Inventor · disambiguated record
Hiroshi Tazawa
Also filed as: TAZAWA HIROSHI
41 granted patents·7 pending applications·893 citations·filing 1991–2024
97Inventor score
Top patents by PatentIndex Score
48 records- 0194US5394010ASemiconductor assembly having laminated semiconductor devicesTOSHIBA KK·Filed 1992·Granted Feb 28, 1995·182 cites·13 claims
- 0293US6111317AFlip-chip connection type semiconductor integrated circuit deviceTOSHIBA KK·Filed 1997·Granted Aug 29, 2000·157 cites·16 claims
- 0389US5801447AFlip chip mounting type semiconductor deviceTOSHIBA KK·Filed 1996·Granted Sep 1, 1998·107 cites·5 claims
- 0489US5631499ASemiconductor device comprising fine bump electrode having small side etch portion and stable characteristicsTOSHIBA KK·Filed 1996·Granted May 20, 1997·118 cites·12 claims
- 0585US11194135B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2019·Granted Dec 7, 2021·2 cites·8 claims
- 0685US5773888ASemiconductor device having a bump electrode connected to an inner leadTOSHIBA KK·Filed 1995·Granted Jun 30, 1998·84 cites·7 claims
- 0783US11130299B2Lens-attached substrate, stacked lens structure, camera module, and manufacturing apparatus and methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Sep 28, 2021·2 cites·8 claims
- 0882US2025236064A1Master, transferred object, and method of producing masterDEXERIALS CORP·Filed 2024·Application pending·0 cites
- 0981US10379323B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Aug 13, 2019·1 cites·21 claims
- 1081US9937675B2Transfer mold and manufacturing method for structureSONY CORP·Filed 2014·Granted Apr 10, 2018·4 cites·17 claims
- 1181US5747881ASemiconductor device, method of fabricating the same and copper leadsTOSHIBA KK·Filed 1996·Granted May 5, 1998·54 cites·28 claims
- 1280US10431618B2Stacked lens structure method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2016·Granted Oct 1, 2019·1 cites·38 claims
- 1380US5825081ATape carrier and assembly structure thereofTOSHIBA KK·Filed 1996·Granted Oct 20, 1998·60 cites·18 claims
- 1479US11543621B2AF module, camera module, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2018·Granted Jan 3, 2023·2 cites·10 claims
- 1578US11525984B2Lens attached substrate, layered lens structure, camera module, manufacturing apparatus, and manufacturing methodSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2021·Granted Dec 13, 2022·0 cites·14 claims
- 1674US10818717B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2019·Granted Oct 27, 2020·0 cites·20 claims
- 1770US11342371B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY CORP·Filed 2020·Granted May 24, 2022·0 cites·17 claims
- 1870US6049130ASemiconductor device using gold bumps and copper leads as bonding elementsTOSHIBA KK·Filed 1997·Granted Apr 11, 2000·32 cites·3 claims
- 1969US12208565B2Master, transferred object, and method of producing masterDEXERIALS CORP·Filed 2018·Granted Jan 28, 2025·0 cites·14 claims
- 2067US9535191B2Optical element, method for producing the same, and display apparatusTAZAWA HIROSHI·Filed 2010·Granted Jan 3, 2017·2 cites·14 claims
- 2167US5304843ASemiconductor device using film carrierTOSHIBA KK·Filed 1992·Granted Apr 19, 1994·40 cites·27 claims
- 2266US10627549B2Stacked lens structure, method of manufacturing the same, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Apr 21, 2020·1 cites·20 claims
- 2365US8467130B2Retardation film, method of producing the same and display deviceKURIYAMA AKITO·Filed 2011·Granted Jun 18, 2013·1 cites·8 claims
- 2461US11897182B2Resin laminated optical body and method for manufacturing the sameDEXERIALS CORP·Filed 2019·Granted Feb 13, 2024·0 cites·12 claims
- 2560US9709706B2Optical unit, imaging device, electronic apparatus, and masterSONY CORP·Filed 2014·Granted Jul 18, 2017·1 cites·14 claims
- 2659US12399303B2Laminate, method of producing laminate, method of forming optical body, and camera module-equipped deviceDEXERIALS CORP·Filed 2019·Granted Aug 26, 2025·0 cites·11 claims
- 2759US9603257B2Pattern substrate, method of producing the same, information input apparatus, and display apparatusTAZAWA HIROSHI·Filed 2011·Granted Mar 21, 2017·1 cites·14 claims
- 2855US5508563ASemiconductor assembly having laminated semiconductor devicesTOSHIBA KK·Filed 1994·Granted Apr 16, 1996·20 cites·6 claims
- 2952US11874436B2Optical device having fluid-filled partitioned spaces with electric field control materialDEXERIALS CORP·Filed 2020·Granted Jan 16, 2024·0 cites·4 claims
- 3051US9288891B2Conductive element and method of manufacturing the same, wiring element, and master copySONY CORP·Filed 2013·Granted Mar 15, 2016·0 cites·20 claims
- 3150US10534162B2Lens attached substrate, layered lens structure, manufacturing method thereof, and electronic deviceSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Jan 14, 2020·0 cites·18 claims
- 3249US12099221B2Optical filter and light-emitting deviceDEXERIALS CORP·Filed 2019·Granted Sep 24, 2024·0 cites·6 claims
- 3349US10690814B2Lens substrate, semiconductor device, and electronic apparatusSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Jun 23, 2020·0 cites·20 claims
- 3448US12352926B2Concave-convex structure, optical member, and electronic apparatusDEXERIALS CORP·Filed 2018·Granted Jul 8, 2025·0 cites·15 claims
- 3548US2023124524A1Optical body, method for manufacturing optical body, and optical deviceDEXERIALS CORP·Filed 2021·Application pending·0 cites
- 3648US2012070623A1Manufacturing method of laminated body, stamper, transfer device, laminated body, molding element, and optical elementHAYASHIBE KAZUYA·Filed 2011·Application pending·0 cites
- 3747US11222875B2Display apparatusSONY CORP·Filed 2018·Granted Jan 11, 2022·0 cites·14 claims
- 3847US2015085369A1Laminated body, imaging element package, imaging apparatus, and electronic apparatusSONY CORP·Filed 2014·Application pending·0 cites
- 3946US9945984B2Optical element, optical system, imaging apparatus, optical instrument, and stamperHAYASHIBE KAZUYA·Filed 2012·Granted Apr 17, 2018·0 cites·21 claims
- 4046US5220486AIc packing deviceTOSHIBA KK·Filed 1991·Granted Jun 15, 1993·16 cites·5 claims
- 4145US2021197504A1Resin laminated optical body, light source unit, optical unit, light irradiation device, image display device, method for manufacturing resin laminated optical body, and method for manufacturing light source unitDEXERIALS CORP·Filed 2019·Application pending·0 cites
- 4244US2015062712A1Optical element and manufacturing method therefor, optical system, imaging apparatus, optical instrument, and masterSONY CORP·Filed 2013·Application pending·0 cites
- 4343US10712543B2Stacked lens structure, method of manufacturing the same, electronic apparatus, mold, method of manufacturing the same, and substrateSONY SEMICONDUCTOR SOLUTIONS CORP·Filed 2016·Granted Jul 14, 2020·0 cites·12 claims
- 4443US2015273792A1Protective film, laminate, display device, and film-attaching unitSONY CORP·Filed 2015·Application pending·0 cites
- 4541US9116289B2Transparent conductive element, information input apparatus, and display apparatusTAZAWA HIROSHI·Filed 2011·Granted Aug 25, 2015·0 cites·18 claims
- 4639US9759840B2Optical element and method for manufacturing optical elementTAKAHASHI HIDETOSHI·Filed 2010·Granted Sep 12, 2017·0 cites·21 claims
- 4735US6061466AApparatus and method for inspecting an LSI device in an assembling process, capable of detecting connection failure of individual flexible leadsTOSHIBA KK·Filed 1996·Granted May 9, 2000·5 cites·15 claims
- 4830US5615822AMethod and apparatus for controlling bonding load of fine lead electrodeTOSHIBA KK·Filed 1995·Granted Apr 1, 1997·0 cites·19 claims
Join the waitlist — get patent alerts
Get an alert when Hiroshi Tazawa files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →