Inventor · disambiguated record
Hiroki Terazaki
Also filed as: TERAZAKI HIROKI
20 granted patents·3 pending applications·334 citations·filing 1997–2012
95Inventor score
Technology areasH10P
Top patents by PatentIndex Score
23 records- 0193US6221118B1Cerium oxide abrasive and method of polishing substratesHITACHI CHEMICAL CO LTD·Filed 1997·Granted Apr 24, 2001·123 cites·1 claims
- 0290US6863700B2Cerium oxide abrasive and method of polishing substratesHITACHI CHEMICAL CO LTD·Filed 2001·Granted Mar 8, 2005·37 cites·17 claims
- 0388US6343976B1Abrasive, method of polishing wafer, and method of producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 1998·Granted Feb 5, 2002·60 cites·27 claims
- 0486US6899821B2Abrasive liquid for metal and method for polishingHITACHI LTD·Filed 2001·Granted May 31, 2005·31 cites·9 claims
- 0584US8491807B2Abrasive liquid for metal and method for polishingUCHIDA TAKESHI·Filed 2011·Granted Jul 23, 2013·5 cites·22 claims
- 0673US6896825B1Abrasive liquid for metal and method for polishingHITACHI LTD·Filed 1999·Granted May 24, 2005·30 cites·25 claims
- 0771US8616936B2Abrasive, method of polishing target member and process for producing semiconductor deviceYOSHIDA MASATO·Filed 2012·Granted Dec 31, 2013·1 cites·17 claims
- 0871US8137159B2Abrasive, method of polishing target member and process for producing semiconductor deviceYOSHIDA MASATO·Filed 2011·Granted Mar 20, 2012·1 cites·25 claims
- 0971US7115021B2Abrasive, method of polishing target member and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2002·Granted Oct 3, 2006·8 cites·20 claims
- 1069US8226849B2Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameUCHIDA TAKESHI·Filed 2006·Granted Jul 24, 2012·2 cites·18 claims
- 1168US8162725B2Abrasive, method of polishing target member and process for producing semiconductor deviceYOSHIDA MASATO·Filed 2007·Granted Apr 24, 2012·1 cites·20 claims
- 1268US7963825B2Abrasive, method of polishing target member and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2008·Granted Jun 21, 2011·1 cites·21 claims
- 1368US7871308B2Abrasive, method of polishing target member and process for producing semiconductor deviceHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jan 18, 2011·1 cites·30 claims
- 1465US7799686B2Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameHITACHI LTD·Filed 2007·Granted Sep 21, 2010·1 cites·35 claims
- 1564US7708788B2Cerium oxide abrasive and method of polishing substratesHITACHI CHEMICAL CO LTD·Filed 2004·Granted May 4, 2010·6 cites·12 claims
- 1663US7799688B2Polishing fluid and method of polishingHITACHI CHEMICAL CO LTD·Filed 2003·Granted Sep 21, 2010·8 cites·11 claims
- 1759US7250369B1Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameHITACHI CHEMICAL CO LTD·Filed 1999·Granted Jul 31, 2007·16 cites·13 claims
- 1855US8900477B2Materials for polishing liquid for metal, polishing liquid for metal, method for preparation thereof and polishing method using the sameUCHIDA TAKESHI·Filed 2008·Granted Dec 2, 2014·0 cites·36 claims
- 1952US7867303B2Cerium oxide abrasive and method of polishing substratesHITACHI CHEMICAL CO LTD·Filed 2006·Granted Jan 11, 2011·0 cites·45 claims
- 2051US8038898B2Abrasive liquid for metal and method for polishingHITACHI CHEMICAL CO LTD·Filed 2004·Granted Oct 18, 2011·2 cites·15 claims
- 2146US2010301265A1Polishing slurry and method of polishingHITACHI CHEMICAL CO LTD·Filed 2010·Application pending·0 cites
- 2241US2007196975A1Metal-Polishing Liquid And Polishing Method Using The SameHITACHI CHEMICAL CO LTD·Filed 2005·Application pending·0 cites
- 2336US2003219982A1CMP (chemical mechanical polishing) polishing liquid for metal and polishing methodHITACHI CHEMICAL CO LTD·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →