Inventor · disambiguated record
Hiroyuki Tomimatsu
Also filed as: TOMIMATSU HIROYUKI
9 granted patents·1 pending application·88 citations·filing 2002–2023
86Inventor score
Top patents by PatentIndex Score
10 records- 0187US7314818B2Semiconductor device and method of manufacturing the same, circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2006·Granted Jan 1, 2008·16 cites·22 claims
- 0282US6933172B2Semiconductor wafer with spacer and its manufacturing method, semiconductor device and its manufacturing method, and circuit substrate and electronic deviceSEIKO EPSON CORP·Filed 2003·Granted Aug 23, 2005·42 cites·34 claims
- 0370US7064425B2Semiconductor device circuit board, and electronic equipmentSEIKO EPSON CORP·Filed 2003·Granted Jun 20, 2006·16 cites·14 claims
- 0461US6727574B2Semiconductor device and method for manufacturing the same, circuit substrate and electronic apparatusSEIKO EPSON CORP·Filed 2002·Granted Apr 27, 2004·10 cites·23 claims
- 0556US12397554B2Liquid ejection device and method for controlling liquid ejection deviceSEIKO EPSON CORP·Filed 2023·Granted Aug 26, 2025·0 cites·9 claims
- 0655US9050800B2Liquid ejecting head and liquid ejecting apparatusSEIKO EPSON CORP·Filed 2013·Granted Jun 9, 2015·0 cites·17 claims
- 0751US8550602B2Liquid ejecting head and liquid ejecting apparatusITO HIROSHI·Filed 2012·Granted Oct 8, 2013·0 cites·6 claims
- 0848US7132738B2Semiconductor device having multiple semiconductor chips stacked in layers and method for manufacturing the same, circuit substrate and electronic apparatusSEIKO EPSON CORP·Filed 2004·Granted Nov 7, 2006·4 cites·6 claims
- 0934US2004224481A1Semiconductor devices, manufacturing methods therefor, circuit substrates and electronic devicesSEIKO EPSON CORP·Filed 2004·Application pending·0 cites
- 1033US6770511B2Semiconductor device, and its manufacturing method, circuit substrate, and electronic apparatusSEIKO EPSON CORP·Filed 2003·Granted Aug 3, 2004·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →