Inventor · disambiguated record
Hideki Toya
Also filed as: TOYA HIDEKI
8 granted patents·3 pending applications·131 citations·filing 1998–2015
86Inventor score
Top patents by PatentIndex Score
11 records- 0185US6107411ABlock copolymer, block copolymer composition and heat shrinkable films made thereofDENKI KAGAKU KOGYO KK·Filed 1998·Granted Aug 22, 2000·70 cites·7 claims
- 0272US8258236B2Tubular forming material and its heat-shrinkable filmSAWASATO TADASHI·Filed 2007·Granted Sep 4, 2012·4 cites·4 claims
- 0366US6410649B1Resin compositionDENKI KAGAKU KOGYO KK·Filed 1999·Granted Jun 25, 2002·22 cites·17 claims
- 0461US6664133B2Lead frame and method of manufacturing the sameSHINKO ELECTRIC IND CO·Filed 2002·Granted Dec 16, 2003·14 cites·2 claims
- 0560US7470747B2Block copolymer mixture and heat shrinkable film using itDENKI KAGAKU KOGYO KK·Filed 2006·Granted Dec 30, 2008·4 cites·25 claims
- 0656US9475925B2Blended rubber, blended rubber composition and vulcanizateDENKI KAGAKU KOGYO KK·Filed 2014·Granted Oct 25, 2016·0 cites·20 claims
- 0756US6700198B2Resin for semiconductor wireSHINKO ELECTRIC IND CO·Filed 2001·Granted Mar 2, 2004·8 cites·1 claims
- 0849US2010105838A1Material for md shrink and md shrink filmDENKI KAGAKU KOGYO KK·Filed 2008·Application pending·0 cites
- 0944US2007026175A1Heat-shrinkable foam filmsDENKI KAGAKU KOGYO KK·Filed 2004·Application pending·0 cites
- 1041US2017211288A1Rubber bearingDENKA COMPANY LTD·Filed 2015·Application pending·0 cites
- 1139US6348416B1Carrier substrate for producing semiconductor deviceSHINKO ELECTRIC IND CO·Filed 1999·Granted Feb 19, 2002·9 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →