Inventor · disambiguated record
Hirofumi Tsuchiyama
Also filed as: TSUCHIYAMA HIROFUMI
15 granted patents·2 pending applications·198 citations·filing 1999–2014
93Inventor score
Files withHITACHI LTD5RENESAS TECH CORP4HITACHI HIGH TECH CORP2TRECENTI TECHNOLOGIES INC2HITACHI HIGH TECH ELECT ENG CO1
Top patents by PatentIndex Score
17 records- 0192US6753972B1Thin film thickness measuring method and apparatus, and method and apparatus for manufacturing a thin film device using the sameHITACHI LTD·Filed 1999·Granted Jun 22, 2004·87 cites·22 claims
- 0291US6894302B2Surface inspection apparatus and method thereofHITACHI HIGH TECH ELECT ENG CO·Filed 2001·Granted May 17, 2005·35 cites·7 claims
- 0389US7242016B2Surface inspection apparatus and method thereofHITACHI HIGH TECH CORP·Filed 2005·Granted Jul 10, 2007·11 cites·15 claims
- 0488US7417244B2Surface inspection apparatus and method thereofHITACHI LTD·Filed 2007·Granted Aug 26, 2008·9 cites·18 claims
- 0587US7250365B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2005·Granted Jul 31, 2007·10 cites·6 claims
- 0684US7952085B2Surface inspection apparatus and method thereofHITACHI LTD·Filed 2008·Granted May 31, 2011·6 cites·17 claims
- 0782US7977234B2Fabrication method of semiconductor integrated circuit deviceRENESAS ELECTRONICS CORP·Filed 2010·Granted Jul 12, 2011·4 cites·16 claims
- 0877US7234998B2Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor deviceTRECENTI TECHNOLOGIES INC·Filed 2005·Granted Jun 26, 2007·4 cites·5 claims
- 0973US6979649B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2002·Granted Dec 27, 2005·12 cites·15 claims
- 1070US7718526B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2007·Granted May 18, 2010·2 cites·4 claims
- 1168US6806970B2Thin film thickness measuring method and apparatus, and method and apparatus for manufacturing a thin film device using the sameHITACHI LTD·Filed 2003·Granted Oct 19, 2004·12 cites·10 claims
- 1264US9551670B2Surface inspection apparatus and method thereofHITACHI HIGH TECH CORP·Filed 2014·Granted Jan 24, 2017·0 cites·11 claims
- 1355US8729514B2Surface inspection apparatus and method thereofISHIMARU ICHIRO·Filed 2011·Granted May 20, 2014·0 cites·19 claims
- 1451US6468817B2Semiconductor integrated circuit device manufacturing method including chemical mechanical polishing, and detection and evaluation of microscratches caused therebyHITACHI LTD·Filed 2001·Granted Oct 22, 2002·4 cites·12 claims
- 1543US2004203321A1Manufacturing method of semiconductor device, automatic operation method and automatic operation system of semiconductor manufacturing apparatus, and automatic operation method of CMP apparatusTRECENTI TECHNOLOGIES INC·Filed 2004·Application pending·0 cites
- 1639US6979650B2Fabrication method of semiconductor integrated circuit deviceRENESAS TECH CORP·Filed 2004·Granted Dec 27, 2005·2 cites·12 claims
- 1728US2002155650A1Fabrication method of semiconductor integrated circuit deviceFiled 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →