Inventor · disambiguated record
Hiroyuki Tsukahara
Also filed as: TSUKAHARA HIROYUKI
12 granted patents·2 pending applications·466 citations·filing 1983–2016
93Inventor score
Top patents by PatentIndex Score
14 records- 0191US4651341APattern recognition apparatus and a pattern recognition methodFUJITSU LTD·Filed 1983·Granted Mar 17, 1987·83 cites·15 claims
- 0288US5004929AOptical system for detecting three-dimensional shapeFUJITSU LTD·Filed 1989·Granted Apr 2, 1991·73 cites·37 claims
- 0384US4805224APattern matching method and apparatusFUJITSU LTD·Filed 1987·Granted Feb 14, 1989·83 cites·9 claims
- 0481US6555836B1Method and apparatus for inspecting bumps and determining height from a regular reflection regionFUJITSU LTD·Filed 2000·Granted Apr 29, 2003·22 cites·12 claims
- 0578US5999266AMethod for inspecting height, and a height inspection apparatus to carry out the methodFUJITSU LTD·Filed 1997·Granted Dec 7, 1999·48 cites·19 claims
- 0675US4672678APattern recognition apparatusFUJITSU LTD·Filed 1985·Granted Jun 9, 1987·53 cites·8 claims
- 0770US7443516B2Optical-distortion correcting apparatus and optical-distortion correcting methodFUJITSU LTD·Filed 2005·Granted Oct 28, 2008·7 cites·9 claims
- 0867US6052189AHeight measurement device and height measurement methodFUJITSU LTD·Filed 1997·Granted Apr 18, 2000·32 cites·13 claims
- 0964US5298989AMethod of and apparatus for multi-image inspection of bonding wireFUJITSU LTD·Filed 1991·Granted Mar 29, 1994·36 cites·29 claims
- 1061US7593596B2Phase unwrapping method, program, and interference measurement apparatusFUJITSU LTD·Filed 2006·Granted Sep 22, 2009·4 cites·19 claims
- 1145US5243406AMethod and apparatus for measuring three-dimensional configuration of wire-shaped object in a short timeFUJITSU LTD·Filed 1991·Granted Sep 7, 1993·16 cites·26 claims
- 1242US6104493AMethod and apparatus for visual inspection of bump arrayFUJITSU LTD·Filed 1999·Granted Aug 15, 2000·9 cites·25 claims
- 1341US2016377686A1Degradation estimation method, degradation estimation system, and degradation estimation programTOSHIBA KK·Filed 2016·Application pending·0 cites
- 1439US2010251226A1Compile method, computer program product, and semiconductor-integrated-circuit manufacturing methodTOSHIBA KK·Filed 2010·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hiroyuki Tsukahara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →