Inventor · disambiguated record
Hiroaki Tsukamoto
Also filed as: TSUKAMOTO HIROAKI
18 granted patents·19 pending applications·156 citations·filing 1982–2023
93Inventor score
Top patents by PatentIndex Score
37 records- 0191US10682668B2Method of manufacturing a high-strength carbon fiber resin tape and the high-strength carbon fiber resin tapeJAPAN MATEX CO LTD·Filed 2017·Granted Jun 16, 2020·3 cites·20 claims
- 0288US10844523B2Twisted yarn, opened yarn, carbon fiber-covered twisted yarn, and method for manufacturing theseJAPAN MATEX CO LTD·Filed 2017·Granted Nov 24, 2020·3 cites·19 claims
- 0387US11131041B2Apparatus for manufacturing open carbon fiber superfine yarnJAPAN MATEX CO LTD·Filed 2018·Granted Sep 28, 2021·1 cites·16 claims
- 0487US7456483B2Semiconductor device, manufacturing method of semiconductor device and module for optical deviceSHARP KK·Filed 2005·Granted Nov 25, 2008·18 cites·17 claims
- 0584US11060211B2Twisted yarn, opened yarn, carbon fiber-covered twisted yarn, and method for manufacturing theseJAPAN MATEX CO LTD·Filed 2020·Granted Jul 13, 2021·1 cites·6 claims
- 0684US7397023B2Image sensor module with optical path delimiter and accurate alignmentSHARP KK·Filed 2006·Granted Jul 8, 2008·14 cites·8 claims
- 0782US7294828B2Distortion and shock resistant optical device module for image captureSHARP KK·Filed 2006·Granted Nov 13, 2007·13 cites·9 claims
- 0880US7112864B2Module for optical device, and manufacturing method thereforSHARP KK·Filed 2004·Granted Sep 26, 2006·31 cites·15 claims
- 0976US4534173AMeans for supplying a secondary air in an internal combustion engine which is provided with a turbo chargerHONDA MOTOR CO LTD·Filed 1982·Granted Aug 13, 1985·40 cites·4 claims
- 1070US8288710B2Solid-state image sensing device capable of preventing dust from attaching to optical path, method for manufacturing same, and electronic deviceTSUKAMOTO HIROAKI·Filed 2007·Granted Oct 16, 2012·4 cites·9 claims
- 1170US2021301427A1Twisted yarn, opened yarn, carbon fiber-covered twisted yarn, and method for manufacturing theseJAPAN MATEX CO LTD·Filed 2021·Application pending·0 cites
- 1269US11555260B2Apparatus for manufacturing open carbon fiber superfine yarnJAPAN MATEX CO LTD·Filed 2021·Granted Jan 17, 2023·0 cites·2 claims
- 1369US2023303816A1Mixed aqueous dispersion of polyimide-fluororesin-polar crystal particulates and a method of producing the sameJAPAN MATEX CO LTD·Filed 2023·Application pending·0 cites
- 1468US7733408B2Optical device module, optical path fixing device, and method for manufacturing optical device moduleSHARP KK·Filed 2006·Granted Jun 8, 2010·5 cites·27 claims
- 1563US2022403559A1Superfine carbon fiber thread obtained by subjecting opene carbon fiber thread from carbon fiber raw thread to twisting, method for manufacturing the same, and strand or woven yar with the sameJAPAN MATEX CO LTD·Filed 2022·Application pending·0 cites
- 1663US2024384146A1Heat dissipating laminateJAPAN MATEX CO LTD·Filed 2023·Application pending·0 cites
- 1760US9632609B2Sensor sheet, sensor sheet module, touch sensor panel module, and electronic equipmentSHARP KK·Filed 2014·Granted Apr 25, 2017·1 cites·8 claims
- 1859US11603439B2Prepreg and producing method thereofJAPAN MATEX CO LTD·Filed 2020·Granted Mar 14, 2023·0 cites·6 claims
- 1959US11309586B2Power storage device discharge circuit, power storage system, and vehicle equipped with samePANASONIC IP MAN CO LTD·Filed 2020·Granted Apr 19, 2022·0 cites·10 claims
- 2059US5116571AChromoum heat-resistant steel excellent in toughness and having high cracking resistance and high creep strength in welded jointNIPPON KOKAN KK·Filed 1991·Granted May 26, 1992·16 cites·11 claims
- 2157US2021324192A1Mixed aqueous dispersion of polyimide-fluororesin-polar crystal particulates and a method of producing the sameJAPAN MATEX CO LTD·Filed 2020·Application pending·0 cites
- 2252US2008277752A1Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabricationSHARP KK·Filed 2008·Application pending·0 cites
- 2350US11251636B2Power storage device and vehicle comprising samePANASONIC IP MAN CO LTD·Filed 2020·Granted Feb 15, 2022·0 cites·9 claims
- 2449US2005233143A1Packing material and gland packing using the material and process for packing materialTSUKAMOTO KATSURO·Filed 2005·Application pending·0 cites
- 2548US2007267712A1Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabricationFUJITA KAZUYA·Filed 2007·Application pending·0 cites
- 2645US2006197864A1Solid-state imaging deviceSHARP KK·Filed 2006·Application pending·0 cites
- 2745US2017233611A1Method of manufacturing a carbon fiber resin tape and the carbon fiber resin tapeJAPAN MATEX CO LTD·Filed 2015·Application pending·0 cites
- 2843US2017312969A1Method for manufacturing mixture ptfe thread and mixture ptfe thread manufactured by the same methodJAPAN MATEX CO LTD·Filed 2016·Application pending·0 cites
- 2943US2016085346A1Touch panel module and electronic information equipmentSHARP KK·Filed 2014·Application pending·0 cites
- 3042US2004164981A1Solid state imaging device, semiconductor wafer, optical device module, method of solid state imaging device fabrication, and method of optical device module fabricationFiled 2004·Application pending·0 cites
- 3141US2005284578A1Bonding apparatus, bonding method, and method for manufacturing semiconductor deviceSHARP KK·Filed 2005·Application pending·0 cites
- 3241US2004151905A1Packing material and gland packing used the materialFiled 2003·Application pending·0 cites
- 3340US4755234AMethod of manufacturing pressure vessel steel with high strength and toughnessNIPPON KOKAN KK·Filed 1987·Granted Jul 5, 1988·6 cites·8 claims
- 3440US2006043544A1Semiconductor device, semiconductor module, and manufacturing method of semiconductor deviceSHARP KK·Filed 2005·Application pending·0 cites
- 3539US2006208182A1Solid-state image sensing deviceSHARP KK·Filed 2006·Application pending·0 cites
- 3638US2003042691A1Packing material and gland packing used the materialFiled 2002·Application pending·0 cites
- 3734US2018126693A1Heat radiation material having graphite mixture and method for manufacturing the sameJAPAN MATEX CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →