Inventor · disambiguated record
Hidefumi Ueda
Also filed as: UEDA HIDEFUMI
9 granted patents·458 citations·filing 1986–2000
90Inventor score
Top patents by PatentIndex Score
9 records- 0195US5643831AProcess for forming solder balls on a plate having apertures using solder paste and transferring the solder balls to semiconductor deviceFUJITSU LTD·Filed 1995·Granted Jul 1, 1997·231 cites·13 claims
- 0286US6025258AMethod for fabricating solder bumps by forming solder balls with a solder ball forming memberFUJITSU LTD·Filed 1995·Granted Feb 15, 2000·94 cites·41 claims
- 0376US6528346B2Bump-forming method using two plates and electronic deviceFUJITSU LTD·Filed 2000·Granted Mar 4, 2003·24 cites·3 claims
- 0475US6353545B1Inverter apparatus with active current limiting and smoothing circuitYASKAWA DENKI SEISAKUSHO KK·Filed 1999·Granted Mar 5, 2002·50 cites·1 claims
- 0571US5531185AManufacturing apparatus for use in a micro-gravity environmentFUJITSU LTD·Filed 1994·Granted Jul 2, 1996·33 cites·9 claims
- 0668US6656291B1Solder paste and soldering method of the sameFUJITSU LTD·Filed 2000·Granted Dec 2, 2003·13 cites·20 claims
- 0738US4725014AAutomatic locking retractor for a seat belt assemblyASHIMORI IND CO LTD·Filed 1986·Granted Feb 16, 1988·8 cites·3 claims
- 0832US6157181AStep-down DC/DC converter for converting a high DC input voltage into a low DC output voltageYASKAWA DENKI SEISAKUSHO KK·Filed 1998·Granted Dec 5, 2000·5 cites·17 claims
- 0918US6147524AInverter device driving methodYASKAWA DENKI SEISAKUSHO KK·Filed 1997·Granted Nov 14, 2000·0 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →