Inventor · disambiguated record
Hiroshi Uehara
Also filed as: NUNOKAWA KUNIKAZU · UEHARA HIROSHI
129 granted patents·33 pending applications·1,601 citations·filing 1977–2025
99Inventor score
Files withEXEDY CORP92SEMICONDUCTOR ENERGY LAB14MITSUI CHEMICALS INC8DAIKIN MFG CO LTD6HOYA HIROSHI5
Top patents by PatentIndex Score
162 records- 0199US5663077AMethod of manufacturing a thin film transistor in which the gate insulator comprises two oxide filmsSEMICONDUCTOR ENERGY LAB·Filed 1994·Granted Sep 2, 1997·376 cites·14 claims
- 0298US10948024B1Clutch disc and torque limiterEXEDY CORP·Filed 2020·Granted Mar 16, 2021·8 cites·8 claims
- 0395US11408468B2Torque limiter embedded damper deviceEXEDY CORP·Filed 2020·Granted Aug 9, 2022·3 cites·8 claims
- 0495US9732835B2Lockup device for torque converterEXEDY CORP·Filed 2014·Granted Aug 15, 2017·18 cites·9 claims
- 0595US8338697B2Propylene resin composition and use thereofHOYA HIROSHI·Filed 2006·Granted Dec 25, 2012·19 cites·11 claims
- 0695US6283060B1Plasma CVD apparatusSEMICONDUCTOR ENERGY LAB·Filed 1998·Granted Sep 4, 2001·72 cites·19 claims
- 0795US5966594ASemiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 1996·Granted Oct 12, 1999·111 cites·92 claims
- 0893US11608863B2Damper deviceEXEDY CORP·Filed 2021·Granted Mar 21, 2023·2 cites·8 claims
- 0991US10619706B2Speed reducer and motor with speed reducerSHINANO KENSHI CO·Filed 2018·Granted Apr 14, 2020·4 cites·6 claims
- 1091US8592674B2Propylene based resin composition and use thereofHOYA HIROSHI·Filed 2012·Granted Nov 26, 2013·5 cites·14 claims
- 1191US8329848B2Ethylenic copolymer, composition containing the copolymer and use thereofKAJIHARA TAKAYUKI·Filed 2008·Granted Dec 11, 2012·16 cites·19 claims
- 1291US6465284B2Semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 2001·Granted Oct 15, 2002·42 cites·15 claims
- 1391US6461243B1Coil spring assembly and damper mechanismEXEDY CORP·Filed 2000·Granted Oct 8, 2002·28 cites·26 claims
- 1490US12313128B2Power transmission deviceEXEDY CORP·Filed 2022·Granted May 27, 2025·1 cites·4 claims
- 1590US9217078B2Propylene based resin composition and use thereofHOYA HIROSHI·Filed 2012·Granted Dec 22, 2015·4 cites·8 claims
- 1690US8278195B2Plasma CVD apparatusYAMAZAKI SHUNPEI·Filed 2011·Granted Oct 2, 2012·3 cites·28 claims
- 1789US7723218B2Plasma CVD apparatusSEMICONDUCTOR ENERGY LAB·Filed 2005·Granted May 25, 2010·6 cites·111 claims
- 1889US5400887AClutch cover assemblyDAIKIN MFG CO LTD·Filed 1993·Granted Mar 28, 1995·31 cites·12 claims
- 1988US11815148B2Damper deviceEXEDY CORP·Filed 2021·Granted Nov 14, 2023·1 cites·8 claims
- 2088US6445254B1Crystal oscillator and method of bonding IC chip useful for fabricating crystal oscillatorNIHON DEMPA KOGYO CO·Filed 2000·Granted Sep 3, 2002·43 cites·19 claims
- 2188US6210997B1Semiconductor device and method for manufacturing the sameSEMICONDUCTOR ENERGY LAB·Filed 1999·Granted Apr 3, 2001·50 cites·29 claims
- 2287US4129524ARadiation shielding material and a process for producing the sameKYOWA GAS CHEM IND CO LTD·Filed 1977·Granted Dec 12, 1978·39 cites·34 claims
- 2386US8962974B2Propylene based resin composition and use thereofHOYA HIROSHI·Filed 2012·Granted Feb 24, 2015·2 cites·7 claims
- 2486US5866932AInsulating film formed using an organic silane and method of producing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 1996·Granted Feb 2, 1999·59 cites·28 claims
- 2585US12049937B2Damper deviceEXEDY CORP·Filed 2021·Granted Jul 30, 2024·1 cites·9 claims
- 2685US9969853B2Propylene based resin composition and use thereofMITSUI CHEMICALS INC·Filed 2015·Granted May 15, 2018·1 cites·5 claims
- 2785US8946543B2Propylene based resin composition and use thereofHOYA HIROSHI·Filed 2012·Granted Feb 3, 2015·2 cites·9 claims
- 2884US11841061B2Damper deviceEXEDY CORP·Filed 2021·Granted Dec 12, 2023·1 cites·7 claims
- 2984US4935097AProcess for producing paperMITSUBISHI PAPER MILLS LTD·Filed 1988·Granted Jun 19, 1990·46 cites·19 claims
- 3083US9908983B2Propylene based resin composition and use thereofMITSUI CHEMICALS INC·Filed 2015·Granted Mar 6, 2018·1 cites·8 claims
- 3183US8641537B2Damper mechanismUEHARA HIROSHI·Filed 2011·Granted Feb 4, 2014·7 cites·9 claims
- 3282US9963567B2Propylene based resin composition and use thereofMITSUI CHEMICALS INC·Filed 2015·Granted May 8, 2018·1 cites·15 claims
- 3382US7942749B2Damper mechanismEXEDY CORP·Filed 2007·Granted May 17, 2011·10 cites·12 claims
- 3481US11965576B2Damper deviceEXEDY CORP·Filed 2021·Granted Apr 23, 2024·1 cites·8 claims
- 3581US9441513B2Exhaust gas purification deviceYANMAR CO LTD·Filed 2014·Granted Sep 13, 2016·5 cites·11 claims
- 3680US10968978B2Damper deviceEXEDY CORP·Filed 2019·Granted Apr 6, 2021·2 cites·12 claims
- 3780US5837614AInsulating film and method of producing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 1997·Granted Nov 17, 1998·45 cites·21 claims
- 3879US12209631B2Damper deviceEXEDY CORP·Filed 2023·Granted Jan 28, 2025·0 cites·5 claims
- 3978US9126293B2Assembling method of vehicular air-conditioning apparatusUTO TAICHI·Filed 2010·Granted Sep 8, 2015·5 cites·7 claims
- 4077US8053338B2Plasma CVD apparatusSEMICONDUCTOR ENERGY LAB·Filed 2009·Granted Nov 8, 2011·1 cites·77 claims
- 4177US6304151B1Crystal oscillator and method of fabricating the sameNIHON DEMPA KOGYO CO·Filed 2000·Granted Oct 16, 2001·20 cites·15 claims
- 4277US6025630AInsulating film formed using an organic silane and method of producing semiconductor deviceSEMICONDUCTOR ENERGY LAB·Filed 1998·Granted Feb 15, 2000·36 cites·16 claims
- 4377US5385224AClutch cover assemblyDAIKIN MFG CO LTD·Filed 1993·Granted Jan 31, 1995·26 cites·6 claims
- 4476US9822841B2Flywheel assemblyEXEDY CORP·Filed 2014·Granted Nov 21, 2017·5 cites·6 claims
- 4576US7339309B2Surface mount crystal oscillatorNIHON DEMPA KOGYO CO·Filed 2005·Granted Mar 4, 2008·10 cites·19 claims
- 4675US6499427B1Plasma CVD apparatusSEMICONDUCTOR ENERGY LAB·Filed 2001·Granted Dec 31, 2002·8 cites·10 claims
- 4774US11545872B2Motor with brakeSHINANO KENSHI CO·Filed 2020·Granted Jan 3, 2023·1 cites·5 claims
- 4874US9599187B2Damper deviceEXEDY CORP·Filed 2015·Granted Mar 21, 2017·2 cites·8 claims
- 4974US7192354B2Damper mechanism and damper disk assemblyEXEDY CORP·Filed 2004·Granted Mar 20, 2007·15 cites·17 claims
- 5073US9599186B2Damper deviceEXEDY CORP·Filed 2015·Granted Mar 21, 2017·2 cites·9 claims
Showing the top 50 of 162 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hiroshi Uehara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →