Inventor · disambiguated record
Hiroshi Ueki
Also filed as: UEKI HIROSHI
52 granted patents·18 pending applications·354 citations·filing 1975–2024
98Inventor score
Files withDOW CORNING TORAY SILICONE11MORITA YOSHITSUGU11MURATA MANUFACTURING CO11RENESAS ELECTRONICS CORP7DOW CORNING TORAY CO LTD6
Top patents by PatentIndex Score
70 records- 0188US8044162B2Adhesion-promoting agent, curable organopolysiloxane composition, and semiconductor deviceDOW CORNING TORAY CO LTD·Filed 2007·Granted Oct 25, 2011·7 cites·9 claims
- 0285US11127528B2Coil componentMURATA MANUFACTURING CO·Filed 2018·Granted Sep 21, 2021·2 cites·15 claims
- 0385US6239245B1Resin additive, curable resin composition, and cured resinDOW CORNING TORAY SILICONE·Filed 2000·Granted May 29, 2001·22 cites·8 claims
- 0484US12037481B2Curable organopolysiloxane composition for forming films, and method for producing organopolysiloxane cured filmDOW TORAY CO LTD·Filed 2019·Granted Jul 16, 2024·1 cites·20 claims
- 0583US6590032B2Thermoplastic resin composition and moldings therefromDOW CORNING TORAY SILICONE·Filed 2001·Granted Jul 8, 2003·22 cites·19 claims
- 0680US6303681B1Flame-retardant polyolefin-type resin composition, method for the preparation thereof, and flame retardant cablesDOW CORNING TORAY SILICONE·Filed 2000·Granted Oct 16, 2001·15 cites·15 claims
- 0780US2025132083A1Laminated coil componentMURATA MANUFACTURING CO·Filed 2024·Application pending·0 cites
- 0879US6297341B1Silicone-containing polyimide resin, silicon-containing polyamic acid, and methods for manufactureDOW CORNING TORAY SILICONE·Filed 2000·Granted Oct 2, 2001·15 cites·11 claims
- 0978US7842755B2Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promoterDOW CORNING TORAY CO LTD·Filed 2005·Granted Nov 30, 2010·7 cites·16 claims
- 1076US6309107B1Linear motion guide unitNIPPON THOMPSON CO LTD·Filed 2000·Granted Oct 30, 2001·15 cites·12 claims
- 1175US4022639AMethod for removing carbon scaleKURITA WATER IND LTD·Filed 1975·Granted May 10, 1977·16 cites·12 claims
- 1273US6133394AMethod for the preparation of organofunctional organopentasiloxane, organic resin modifier and organic resinsDOW CORNING TORAY SILICONE·Filed 1999·Granted Oct 17, 2000·16 cites·18 claims
- 1373US5671177ANon-volatile semiconductor storage apparatusMITSUBISHI ELECTRIC CORP·Filed 1996·Granted Sep 23, 1997·30 cites·7 claims
- 1472US8309652B2Curable silicone composition and cured product therefromMORITA YOSHITSUGU·Filed 2006·Granted Nov 13, 2012·2 cites·17 claims
- 1571US7138467B2Silicone resin composition, curable resin composition, and curable resinDOW CORNING TORAY SILICON CO L·Filed 2003·Granted Nov 21, 2006·9 cites·24 claims
- 1670US12217893B2Laminated coil componentMURATA MANUFACTURING CO·Filed 2021·Granted Feb 4, 2025·0 cites·20 claims
- 1768US8063143B2Curable organopolysiloxane composition, method of curing thereof, semiconductor device, and adhesion promotorMORITA YOSHITSUGU·Filed 2010·Granted Nov 22, 2011·2 cites·16 claims
- 1868US7863391B2Organopolysiloxane and curable silicone composition that contains aforementioned organopolysiloxaneDOW CORNING TORAY CO LTD·Filed 2005·Granted Jan 4, 2011·1 cites·7 claims
- 1967US9344101B2Semiconductor device, electronic device and sensing methodRENESAS ELECTRONICS CORP·Filed 2015·Granted May 17, 2016·2 cites·12 claims
- 2067US6660807B2Additive for organic resin and organic resin compositionDOW CORNING TORAY SILCONE CO L·Filed 2001·Granted Dec 9, 2003·7 cites·7 claims
- 2163US7105614B2Curable epoxy resin compositionDOW CORNING TORAY SILICONE·Filed 2002·Granted Sep 12, 2006·5 cites·7 claims
- 2262US8563666B2Curable silicone composition and cured product thereofMORITA YOSHITSUGU·Filed 2008·Granted Oct 22, 2013·0 cites·13 claims
- 2362US6699925B2Flame-retardant thermoplastic resin composition and manufacturing method thereofDOW CORNING TORAY SILICONE·Filed 2001·Granted Mar 2, 2004·5 cites·18 claims
- 2462US5825688ANon-volatile semiconductor storage apparatusMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Oct 20, 1998·18 cites·2 claims
- 2561US6136521APolycarbonate, and molding and electrophotographic photoreceptor prepared therefromIDEMITSU KOSAN CO·Filed 1998·Granted Oct 24, 2000·16 cites·17 claims
- 2659US5726271AHydroxyphenyl-containing polyorganosiloxanesDOW CORNING TORAY SILICONE·Filed 1996·Granted Mar 10, 1998·14 cites·13 claims
- 2758US12272488B2Common-mode choke coilMURATA MANUFACTURING CO·Filed 2021·Granted Apr 8, 2025·0 cites·20 claims
- 2858US12131854B2Common-mode choke coilMURATA MANUFACTURING CO·Filed 2021·Granted Oct 29, 2024·0 cites·19 claims
- 2958US6651152B1Microcomputer including download circuit controlling data download to plurality of memoriesMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Nov 18, 2003·6 cites·20 claims
- 3058US6534576B2Flame retardant organic resin compositionDOW CORNING TORAY SILICONE·Filed 2001·Granted Mar 18, 2003·2 cites·19 claims
- 3157US12080469B2Common-mode choke coilMURATA MANUFACTURING CO·Filed 2021·Granted Sep 3, 2024·0 cites·20 claims
- 3257US7863399B2Curing silicone composition and cured product thereofDOW CORNING TORAY CO LTD·Filed 2004·Granted Jan 4, 2011·2 cites·19 claims
- 3357US5654366AThermoplastic resin compositionDOW CORNING TORAY SILICONE·Filed 1996·Granted Aug 5, 1997·16 cites·12 claims
- 3457US2023403009A1Semiconductor device and power supply control processing method for control circuit of semiconductor deviceRENESAS ELECTRONICS CORP·Filed 2023·Application pending·0 cites
- 3556US12119153B2Common-mode choke coilMURATA MANUFACTURING CO·Filed 2021·Granted Oct 15, 2024·0 cites·20 claims
- 3656US8674037B2Silicon-containing polymer, method of manufacturing thereof, and curable polymer compositionMORITA YOSHITSUGU·Filed 2009·Granted Mar 18, 2014·0 cites·6 claims
- 3756US7781522B2Curable silicone composition and cured product thereofDOW CORNING TORAY CO LTD·Filed 2004·Granted Aug 24, 2010·2 cites·13 claims
- 3856US2010209707A1Cross-linked silicone particles and method of manufacturing thereofMORITA YOSHITSUGU·Filed 2008·Application pending·0 cites
- 3955US12080470B2Common-mode choke coilMURATA MANUFACTURING CO·Filed 2021·Granted Sep 3, 2024·0 cites·16 claims
- 4055US12009128B2Common-mode choke coilMURATA MANUFACTURING CO·Filed 2021·Granted Jun 11, 2024·0 cites·20 claims
- 4155US11942248B2Common-mode choke coilMURATA MANUFACTURING CO·Filed 2021·Granted Mar 26, 2024·0 cites·18 claims
- 4255US8227528B2Curable epoxy resin composition and cured product thereofMORITA YOSHITSUGU·Filed 2008·Granted Jul 24, 2012·0 cites·15 claims
- 4354US12073968B2Common-mode choke coilMURATA MANUFACTURING CO·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 4454US2010292400A1Curable Liquid Epoxy Resin Composition and Cured Product ThereofMORITA YOSHITSUGU·Filed 2008·Application pending·0 cites
- 4554US2010234520A1Curable Epoxy Resin Composition and Cured Body ThereofMORITA YOSHITSUGU·Filed 2008·Application pending·0 cites
- 4653US6130019ABinder carrierMINOLTA CO LTD·Filed 1998·Granted Oct 10, 2000·10 cites·25 claims
- 4752US2010022704A1Curable Silicone Composition And Cured Body ThereofMORITA YOSHITSUGU·Filed 2007·Application pending·0 cites
- 4849US5649768ACompound rolling guide unitNIPPON THOMPSON CO LTD·Filed 1996·Granted Jul 22, 1997·12 cites·13 claims
- 4949US2015161307A1Method of Designing Semiconductor Device, Designing Assistance Program, Designing Apparatus, and Semiconductor DeviceRENESAS ELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 5048US2008319144A1Silicone Resin Composition, Curable Resin Composition, and Cured ResinDOW CORNING TORAY CO LTD·Filed 2005·Application pending·0 cites
Showing the top 50 of 70 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Hiroshi Ueki files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →