Inventor · disambiguated record
Hiroyuki Urano
Also filed as: URANO HIROYUKI
27 granted patents·8 pending applications·52 citations·filing 2003–2025
93Inventor score
Top patents by PatentIndex Score
35 records- 0194US8835697B2Biphenyl derivative, resist bottom layer material, bottom layer forming method, and patterning processKORI DAISUKE·Filed 2012·Granted Sep 16, 2014·9 cites·5 claims
- 0291US10457779B2Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, positive photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2017·Granted Oct 29, 2019·4 cites·18 claims
- 0389US10816900B2Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 27, 2020·3 cites·8 claims
- 0488US7909513B2Rolling bearing deviceJTEKT CORP·Filed 2006·Granted Mar 22, 2011·11 cites·3 claims
- 0587US9377689B2Silicone structure-bearing polymer, negative resist composition, photo-curable dry film, patterning process, and electric/electronic part-protecting filmSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 28, 2016·5 cites·15 claims
- 0683US9091919B2Silicone structure-bearing polymer, resin composition, and photo-curable dry filmSHINETSU CHEMICAL CO·Filed 2013·Granted Jul 28, 2015·6 cites·4 claims
- 0781US10216085B2Tetracarboxylic acid diester compound, polyimide precursor polymer and method for producing the same, negative photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2017·Granted Feb 26, 2019·2 cites·8 claims
- 0872US9400428B2Polymer compound, chemically amplified negative resist composition, photo-curable dry film and production method thereof, layered product, patterning process, and substrateSHINETSU CHEMICAL CO·Filed 2014·Granted Jul 26, 2016·1 cites·21 claims
- 0968US12197127B2Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2022·Granted Jan 14, 2025·0 cites·13 claims
- 1065US11333975B2Polymer, photosensitive resin composition, patterning method, method of forming cured film, interlayer insulating film, surface protective film, and electronic componentIBM·Filed 2020·Granted May 17, 2022·0 cites·20 claims
- 1165US10919918B2Tetracarboxylic dianhydride, polyimide resin and method for producing the same, photosensitive resin compositions, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic partsSHINETSU CHEMICAL CO·Filed 2018·Granted Feb 16, 2021·0 cites·20 claims
- 1263US7178986B2Rolling bearingKOYO SEIKO CO·Filed 2003·Granted Feb 20, 2007·10 cites·7 claims
- 1363US2025147420A1Polymer, Positive And Negative Photosensitive Resin Compositions, Patterning Process, Method For Forming Cured Film, Interlayer Insulating Film, Surface Protective Film, And Electronic ComponentSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1462US2025068070A1Negative-type photosensitive resin composition, patterning method, method for forming cured film, interlayer insulative film, surface-protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2024·Application pending·0 cites
- 1561US9366961B2Silicone structure-bearing polymer, resin composition, and photo-curable dry filmSHINETSU CHEMICAL CO·Filed 2015·Granted Jun 14, 2016·0 cites·13 claims
- 1660US11572442B2Compound, polyimide resin and method of producing the same, photosensitive resin composition, patterning method and method of forming cured film, interlayer insulating film, surface protective film, and electronic componentIBM·Filed 2020·Granted Feb 7, 2023·0 cites·19 claims
- 1759US12195568B2Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2022·Granted Jan 14, 2025·0 cites·18 claims
- 1859US10203601B2Tetracarboxylic acid diester compound, polymer of polyimide precursor and method for producing same, negative photosensitive resin composition, patterning process, and method for forming cured filmSHINETSU CHEMICAL CO·Filed 2017·Granted Feb 12, 2019·0 cites·2 claims
- 1959US2025355350A1Negative-type photosensitive resin composition, patterning process, method for forming cured coating, interlayer insulating film, surface protecting film, and electronic componentSHINETSU CHEMICAL CO·Filed 2025·Application pending·0 cites
- 2057US12085856B2Positive photosensitive resin composition, positive photosensitive dry film, method for producing positive photosensitive dry film, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2021·Granted Sep 10, 2024·0 cites·16 claims
- 2157US2020326624A1Positive photosensitive resin composition, patterning process, method of forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2020·Application pending·0 cites
- 2257US2023350294A1Negative Photosensitive Resin Composition, Patterning Process, Interlayer Insulating Film, Surface Protection Film, And Electronic ComponentSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 2356US2022043348A1Negative photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2021·Application pending·0 cites
- 2455US8439570B2Rolling bearing assembly and method of forming a lubrication device thereforURANO HIROYUKI·Filed 2009·Granted May 14, 2013·1 cites·5 claims
- 2552US11892773B2Photosensitive resin composition, patterning process, method for forming cured film, interlayer insulation film, surface protective film, and electronic componentSHINETSU CHEMICAL CO·Filed 2021·Granted Feb 6, 2024·0 cites·16 claims
- 2652US2014205951A1Thermal crosslinking accelerator, polysiloxane-containing resist underlayer film forming composition containing same, and patterning process using sameSHINETSU CHEMICAL CO·Filed 2013·Application pending·0 cites
- 2751US2018081272A1Thermal crosslinking accelerator, polysiloxane-containing resist underlayer film forming composition containing same, and patterning process using sameSHINETSU CHEMICAL CO·Filed 2017·Application pending·0 cites
- 2846US11768434B2Polymer having a structure of polyamide, polyamide-imide, or polyimide, photosensitive resin composition, patterning process, photosensitive dry film, and protective film for electric and electronic partsSHINETSU CHEMICAL CO·Filed 2019·Granted Sep 26, 2023·0 cites·19 claims
- 2946US9310681B2Negative resist composition and patterning process using sameSHINETSU CHEMICAL CO·Filed 2014·Granted Apr 12, 2016·0 cites·12 claims
- 3044US11150556B2Polymer of polyimide precursor, positive type photosensitive resin composition, negative type photosensitive resin composition, patterning process, method for forming cured film, interlayer insulating film, surface protective film, and electronic partsSHINETSU CHEMICAL CO·Filed 2018·Granted Oct 19, 2021·0 cites·16 claims
- 3143US8865391B2Chemically amplified negative resist composition, photo-curable dry film, making method, pattern forming process, and electric/electronic part protecting filmSHINETSU CHEMICAL CO·Filed 2012·Granted Oct 21, 2014·0 cites·16 claims
- 3240US10087288B2Silicone skeleton-containing polymer compound, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, substrate, and semiconductor apparatusSHINETSU CHEMICAL CO·Filed 2015·Granted Oct 2, 2018·0 cites·25 claims
- 3337US10197914B2Positive photosensitive resin composition, photo-curable dry film and method for producing the same, patterning process, and laminateSHINETSU CHEMICAL CO·Filed 2017·Granted Feb 5, 2019·0 cites·20 claims
- 3436US10114287B2Silicone skeleton-containing polymer compound and method for producing same, chemically amplified negative resist composition, photo-curable dry film and method for producing same, patterning process, layered product, and substrateSHINETSU CHEMICAL CO·Filed 2015·Granted Oct 30, 2018·0 cites·32 claims
- 3535US9557645B2Positive photosensitive resin composition, photo-curable dry film and method for producing same, layered product, patterning process, and substrateSHINETSU CHEMICAL CO·Filed 2015·Granted Jan 31, 2017·0 cites·21 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →