Inventor · disambiguated record
Hiroyuki Utsunomiya
Also filed as: UTSUNOMIYA HIROYUKI
9 granted patents·12 pending applications·1 citations·filing 2005–2025
75Inventor score
Top patents by PatentIndex Score
21 records- 0167US10636707B2Method of manufacturing a semiconductor deviceABLIC INC·Filed 2018·Granted Apr 28, 2020·1 cites·9 claims
- 0263US10143216B2Coated confectioneryMEIJI CO LTD·Filed 2012·Granted Dec 4, 2018·0 cites·11 claims
- 0359US12389924B2Water-containing chocolate-like confectionery and method for producing water-containing chocolate-like confectioneryMEIJI CO LTD·Filed 2019·Granted Aug 19, 2025·0 cites·6 claims
- 0455US2024180174A1Baked confectionary containing cacao compositionMEIJI CO LTD·Filed 2022·Application pending·0 cites
- 0555US2025247411A1Attack analysis device, attack analysis method, and attack analysis programDENSO CORP·Filed 2025·Application pending·0 cites
- 0655US2015004299A1Baked confectionery and method for manufacturing sameMEIJI CO LTD·Filed 2013·Application pending·0 cites
- 0755US2024180171A1Puffed grain flour food containing cacao compositionMEIJI CO LTD·Filed 2022·Application pending·0 cites
- 0853US12245608B2Composition and method for producing the sameMEIJI CO LTD·Filed 2020·Granted Mar 11, 2025·0 cites·9 claims
- 0953US2013337146A1Baked confectioneryKATAGIRI TAKASHI·Filed 2012·Application pending·0 cites
- 1053US2025220035A1Attack analysis device, attack analysis method, and storage medium thereofDENSO CORP·Filed 2025·Application pending·0 cites
- 1151US2025225237A1Information processing device, information processing system, method and storage medium thereofDENSO CORP·Filed 2025·Application pending·0 cites
- 1250US10008466B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2017·Granted Jun 26, 2018·0 cites·15 claims
- 1350US9648893B2Aerated fat-based confectioneryUTSUNOMIYA HIROYUKI·Filed 2011·Granted May 16, 2017·0 cites·9 claims
- 1449US2022361521A1Oleaginous confectionary and method for manufacturing sameMEIJI CO LTD·Filed 2020·Application pending·0 cites
- 1547US9818709B2Semiconductor device and manufacturing method thereofRENESAS ELECTRONICS CORP·Filed 2016·Granted Nov 14, 2017·0 cites·17 claims
- 1646US10840193B2Semiconductor deviceABLIC INC·Filed 2019·Granted Nov 17, 2020·0 cites·11 claims
- 1744US2017318829A1ChocolateMEIJI CO LTD·Filed 2015·Application pending·0 cites
- 1842US2017127697A1Method for Manufacturing Baked ConfectioneryMEIJI CO LTD·Filed 2015·Application pending·0 cites
- 1936US10483223B2Semiconductor device having a large area interconnect or padSII SEMICONDUCTOR CORP·Filed 2017·Granted Nov 19, 2019·0 cites·8 claims
- 2034US2018076150A1Semiconductor chip, semiconductor apparatus, semiconductor wafer, and semiconductor wafer dicing methodSII SEMICONDUCTOR CORP·Filed 2017·Application pending·0 cites
- 2131US2005186743A1Method for manufacturing semiconductor deviceFiled 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →