Inventor · disambiguated record
Hirohiko Watanabe
Also filed as: WATANABE HIROHIKO
20 granted patents·5 pending applications·319 citations·filing 1993–2024
94Inventor score
Files withFUJI ELECTRIC CO LTD12SHOWA ALUMINUM CORP4SHOWA DENKO KK4FUJI ELECTRIC HOLDINGS2HAMANATSU PHOTONICS K K1
Top patents by PatentIndex Score
25 records- 0196US5529116ADuplex heat exchangerSHOWA ALUMINUM CORP·Filed 1993·Granted Jun 25, 1996·123 cites·11 claims
- 0290US6021846ADuplex heat exchangerSHOWA ALUMINUM CORP·Filed 1998·Granted Feb 8, 2000·61 cites·1 claims
- 0388US6250103B1Condenser and air conditioning refrigeration system and using sameSHOWA DENKO KK·Filed 2000·Granted Jun 26, 2001·27 cites·34 claims
- 0487US5743328ADuplex heat exchangerSHOWA ALUMINUM CORP·Filed 1996·Granted Apr 28, 1998·54 cites·3 claims
- 0579US10727194B2Solder material for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2017·Granted Jul 28, 2020·2 cites·11 claims
- 0678US12275094B2Solder jointFUJI ELECTRIC CO LTD·Filed 2023·Granted Apr 15, 2025·0 cites·14 claims
- 0774US12296409B2Solder materialFUJI ELECTRIC CO LTD·Filed 2023·Granted May 13, 2025·0 cites·4 claims
- 0869US11145615B2Solder material for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2020·Granted Oct 12, 2021·0 cites·10 claims
- 0969US10504868B2Solder joiningFUJI ELECTRIC CO LTD·Filed 2018·Granted Dec 10, 2019·1 cites·20 claims
- 1066US11890702B2Solder jointFUJI ELECTRIC CO LTD·Filed 2020·Granted Feb 6, 2024·0 cites·10 claims
- 1166US2021407953A1Solder material for semiconductor deviceFUJI ELECTRIC CO LTD·Filed 2021·Application pending·0 cites
- 1263US7400396B2Fluorescent correalated spectrometric analysis deviceHAMANATSU PHOTONICS K K·Filed 2004·Granted Jul 15, 2008·7 cites·9 claims
- 1363US2025041977A1Solder materialFUJI ELECTRIC CO LTD·Filed 2024·Application pending·0 cites
- 1462US7708054B2Heat exchangerSHOWA DENKO KK·Filed 2004·Granted May 4, 2010·8 cites·5 claims
- 1558US11850685B2Solder materialFUJI ELECTRIC CO LTD·Filed 2019·Granted Dec 26, 2023·0 cites·5 claims
- 1658US6446715B2Flat heat exchange tubesSHOWA ALUMINUM CORP·Filed 2000·Granted Sep 10, 2002·8 cites·13 claims
- 1753US6247529B1Refrigerant tube for a heat exchangerVISTEON GLOBAL TECH INC·Filed 1999·Granted Jun 19, 2001·19 cites·7 claims
- 1852US6370909B2Condenser and air conditioning refrigeration system using the sameSHOWA DENKO KK·Filed 2001·Granted Apr 16, 2002·4 cites·5 claims
- 1947US6684662B2Refrigeration system, and condenser for use in decompressing-tube systemSHOWA DENKO KK·Filed 2002·Granted Feb 3, 2004·2 cites·18 claims
- 2042US10002845B2Lead-free soldering method and soldered articleFUJI ELECTRIC CO LTD·Filed 2016·Granted Jun 19, 2018·0 cites·10 claims
- 2142US7670879B2Manufacturing method of semiconductor module including solid-liquid diffusion joining stepsFUJI ELECTRIC HOLDINGS·Filed 2004·Granted Mar 2, 2010·3 cites·22 claims
- 2241US10189119B2Solder alloy for die bondingNIHON HANDA CO LTD·Filed 2014·Granted Jan 29, 2019·0 cites·8 claims
- 2341US2015044465A1Flux for resin cored solder and resin cored solderFUJI ELECTRIC CO LTD·Filed 2014·Application pending·0 cites
- 2436US2016332262A1Flux for soldering and solder compositionFUJI ELECTRIC CO LTD·Filed 2015·Application pending·0 cites
- 2534US2007152025A1Electronic part mounting methodFUJI ELECTRIC HOLDINGS·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →