Inventor · disambiguated record
Hiroji Yamada
Also filed as: YAMADA HIROJI
5 granted patents·2 pending applications·546 citations·filing 1986–2006
84Inventor score
Top patents by PatentIndex Score
7 records- 0196US6495914B1Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrateHITACHI LTD·Filed 1998·Granted Dec 17, 2002·399 cites·15 claims
- 0291US6492195B2Method of thinning a semiconductor substrate using a perforated support substrateHITACHI LTD·Filed 2000·Granted Dec 10, 2002·115 cites·31 claims
- 0367US7450789B2Micro sensor deviceHITACHI LTD·Filed 2006·Granted Nov 11, 2008·2 cites·6 claims
- 0457US4829155AHair styler having a heat pipe forming the hair winding portionSHISEIDO CO LTD·Filed 1986·Granted May 9, 1989·24 cites·2 claims
- 0554US6984871B2Semiconductor device with high structural reliability and low parasitic capacitanceRENESAS TECH CORP·Filed 2003·Granted Jan 10, 2006·6 cites·10 claims
- 0643US2007073448A1Semiconductor device having a hole or a step of normal mesa shape as viewed from any cross-section and manufacturing method of the sameRENESAS TECH CORP·Filed 2006·Application pending·0 cites
- 0739US2005040497A1Semiconductor device and manufacturing method of the sameFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →