Inventor · disambiguated record
Hirohiko Yamamoto
Also filed as: YAMAMOTO HIROHIKO
29 granted patents·6 pending applications·784 citations·filing 1985–2015
97Inventor score
Top patents by PatentIndex Score
35 records- 0197US6693315B2Semiconductor device with an active region and plural dummy regionsRENESAS TECH CORP·Filed 2001·Granted Feb 17, 2004·93 cites·39 claims
- 0296US4926182AMicrowave data transmission apparatusSHARP KK·Filed 1987·Granted May 15, 1990·354 cites·9 claims
- 0393US7687914B2Semiconductor device and a method of manufacturing the same and designing the sameRENESAS TECH CORP·Filed 2007·Granted Mar 30, 2010·13 cites·16 claims
- 0487US8119495B2Method of manufacturing a semiconductor device having an active region and dummy patternsKURODA KENICHI·Filed 2011·Granted Feb 21, 2012·5 cites·12 claims
- 0585US7411302B2Semiconductor device and a method of manufacturing the same and designing the sameRENESAS TECH CORP·Filed 2006·Granted Aug 12, 2008·5 cites·32 claims
- 0683US6559027B2Semiconductor device and process for producing the smeHITACHI LTD·Filed 2001·Granted May 6, 2003·26 cites·7 claims
- 0783US5346300ABack fire helical antennaSHARP KK·Filed 1992·Granted Sep 13, 1994·72 cites·24 claims
- 0878US6770528B2Method of forming a data-storing capacitive element made in an insulating film on a semiconductor substrateHITACHI ULSI SYS CO LTD·Filed 2003·Granted Aug 3, 2004·23 cites·9 claims
- 0974US8604505B2Semiconductor device and a method of manufacturing the same and designing the sameRENESAS ELECTRONICS CORP·Filed 2013·Granted Dec 10, 2013·1 cites·2 claims
- 1073US7948086B2Semiconductor device and a method of manufacturing the same and designing the sameRENESAS ELECTRONICS CORP·Filed 2010·Granted May 24, 2011·1 cites·8 claims
- 1172US6881646B2Semiconductor device and process for producing the sameHITACHI ULSI SYS CO LTD·Filed 2003·Granted Apr 19, 2005·13 cites·21 claims
- 1270US8334481B2Mounting table structure, and processing apparatusKOMATSU TOMOHITO·Filed 2009·Granted Dec 18, 2012·4 cites·7 claims
- 1370US6242323B1Semiconductor device and process for producing the sameHITACHI LTD·Filed 1998·Granted Jun 5, 2001·28 cites·23 claims
- 1469US6717202B2HSG semiconductor capacitor with migration inhibition layerRENESAS TECH CORP·Filed 2002·Granted Apr 6, 2004·15 cites·25 claims
- 1562US9064926B2Method of manufacturing a semiconductor device including dummy regions and dummy wiringsRENESAS ELECTRONICS CORP·Filed 2013·Granted Jun 23, 2015·0 cites·2 claims
- 1661US9337147B2Semiconductor device and a method of manufacturing the same and designing the sameRENESAS ELECTRONICS CORP·Filed 2015·Granted May 10, 2016·0 cites·2 claims
- 1761US7402473B2Semiconductor device and process for producing the sameRENESAS TECH CORP·Filed 2005·Granted Jul 22, 2008·1 cites·6 claims
- 1861US6289061B1Wideband frequency tracking system and methodSHARP LAB OF AMERICA INC·Filed 1998·Granted Sep 11, 2001·30 cites·4 claims
- 1960US6057241AMethod of manufacturing a semiconductor integrated circuit deviceHITACHI LTD·Filed 1998·Granted May 2, 2000·27 cites·32 claims
- 2058US7589423B2Semiconductor device and a method of manufacturing the same and designing the sameRENESAS TECH CORP·Filed 2007·Granted Sep 15, 2009·0 cites·20 claims
- 2158US6524927B1Semiconductor device and method of fabricating the sameHITACHI LTD·Filed 1999·Granted Feb 25, 2003·17 cites·21 claims
- 2257US8426969B2Semiconductor device having active region and dummy wiringsKURODA KENICHI·Filed 2012·Granted Apr 23, 2013·0 cites·7 claims
- 2357US7071560B2Semiconductor device and a method of manufacturing the same and designing the sameHITACHI ULSI SYS CO LTD·Filed 2003·Granted Jul 4, 2006·2 cites·10 claims
- 2449US6444405B1Method of forming conductive layers in the trenches or through holes made in an insulating film on a semiconductors substrateHITACHI LTD·Filed 2000·Granted Sep 3, 2002·3 cites·2 claims
- 2547US2010323313A1Stage structure and heat treatment apparatusTOKYO ELECRON LTD·Filed 2009·Application pending·0 cites
- 2645US4712111AAntenna systemSHARP KK·Filed 1985·Granted Dec 8, 1987·12 cites·13 claims
- 2742US6343094B1Spread spectrum signal receiving method and apparatus for CDMA cellular communicationSHARP LAB OF AMERICA INC·Filed 1999·Granted Jan 29, 2002·11 cites·13 claims
- 2842US5021790AMicrowave date transmission apparatusSHARP KK·Filed 1990·Granted Jun 4, 1991·21 cites·16 claims
- 2940US2004214428A1Method of forming conductive layers in the trenches or through holes made in an insulating film on a semiconductor substrateRENESAS TECH CORP·Filed 2004·Application pending·0 cites
- 3039US4951111AIntegrated circuit deviceNIPPON ELECTRIC CO·Filed 1985·Granted Aug 21, 1990·7 cites·9 claims
- 3139US2003119276A1Semiconductor device and process for producing the sameFiled 2002·Application pending·0 cites
- 3238US7163849B2Fabrication method of semiconductor integrated circuit deviceRENESAS NTHN JP SEMICONDUCTOR·Filed 2003·Granted Jan 16, 2007·0 cites·4 claims
- 3338US2002098678A1Method of forming conductive layers in the trenches or through holes made in an insulating film on a semiconductor substrateHITACHI LTD·Filed 2002·Application pending·0 cites
- 3437US2004063263A1Manufacturing method of semiconductor devicesFiled 2003·Application pending·0 cites
- 3536US2005233554A1Manufacturing method for semiconductor device and semiconductor manufacturing apparatusTSUGA TOSHIHITO·Filed 2005·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →