Inventor · disambiguated record
Hideyuki Yamamoto
Also filed as: YAMAMOTO HIDEYUKI
91 granted patents·32 pending applications·1,574 citations·filing 1975–2020
99Inventor score
Files withHITACHI LTD33HITACHI HIGH TECH CORP21CASIO COMPUTER CO LTD16IKUHARA SHOJI3KAGOSHIMA AKIRA3
Top patents by PatentIndex Score
123 records- 0198US6755932B2Plasma processing system and apparatus and a sample processing methodHITACHI LTD·Filed 2001·Granted Jun 29, 2004·290 cites·11 claims
- 0296US6618692B2Remote diagnostic system and method for semiconductor manufacturing equipmentHITACHI LTD·Filed 2001·Granted Sep 9, 2003·140 cites·9 claims
- 0394US7464152B2Integrated service management system for remote customer supportHITACHI LTD·Filed 2006·Granted Dec 9, 2008·42 cites·26 claims
- 0494US7158848B2Process monitoring device for sample processing apparatus and control method of sample processing apparatusHITACHI LTD·Filed 2006·Granted Jan 2, 2007·19 cites·2 claims
- 0594US6590179B2Plasma processing apparatus and methodHITACHI LTD·Filed 2001·Granted Jul 8, 2003·66 cites·29 claims
- 0693US7376479B2Process monitoring device for sample processing apparatus and control method of sample processing apparatusHITACHI LTD·Filed 2006·Granted May 20, 2008·15 cites·2 claims
- 0793USD327441SWrist watchCASIO COMPUTER CO LTD·Filed 1990·Granted Jun 30, 1992·43 cites·1 claims
- 0892US7107115B2Method for controlling semiconductor processing apparatusHITACHI HIGH TECH CORP·Filed 2006·Granted Sep 12, 2006·17 cites·2 claims
- 0990US4125759AMethod and apparatus for shortcircuiting arc weldingOSAKA TRANSFORMER CO LTD·Filed 1975·Granted Nov 14, 1978·57 cites·6 claims
- 1089US6825617B2Semiconductor processing apparatusHITACHI HIGH TECH CORP·Filed 2003·Granted Nov 30, 2004·37 cites·11 claims
- 1188US7601240B2Disturbance-free, recipe-controlled plasma processing system and methodHITACHI LTD·Filed 2006·Granted Oct 13, 2009·9 cites·2 claims
- 1288US7085827B2Integrated service management system for remote customer supportHITACHI LTD·Filed 2001·Granted Aug 1, 2006·61 cites·15 claims
- 1388US6903826B2Method and apparatus for determining endpoint of semiconductor element fabricating processHITACHI LTD·Filed 2001·Granted Jun 7, 2005·33 cites·20 claims
- 1486US6879867B2Process monitoring device for sample processing apparatus and control method of sample processing apparatusHITACHI LTD·Filed 2001·Granted Apr 12, 2005·25 cites·19 claims
- 1585US4409465APulse arc welding method and device in which pulse current and background current have a constant current characteristicOSAKA TRANSFORMER CO LTD·Filed 1981·Granted Oct 11, 1983·47 cites·17 claims
- 1683US6716301B2Semiconductor manufacturing apparatus and method of processing semiconductor wafer using plasma, and wafer voltage probeHITACHI LTD·Filed 2001·Granted Apr 6, 2004·25 cites·23 claims
- 1783USD349248SWrist watchCASIO COMPUTER CO LTD·Filed 1992·Granted Aug 2, 1994·23 cites·1 claims
- 1882US6733618B2Disturbance-free, recipe-controlled plasma processing system and methodHITACHI LTD·Filed 2001·Granted May 11, 2004·18 cites·9 claims
- 1980US7126697B2Method and apparatus for determining endpoint of semiconductor element fabricating processHITACHI LTD·Filed 2006·Granted Oct 24, 2006·5 cites·8 claims
- 2080US7058467B2Process monitoring device for sample processing apparatus and control method of sample processing apparatusHITACHI LTD·Filed 2004·Granted Jun 6, 2006·16 cites·2 claims
- 2179US7343217B2System for monitoring and controlling a semiconductor manufacturing apparatus using prediction model equationHITACHI LTD·Filed 2006·Granted Mar 11, 2008·4 cites·5 claims
- 2278US7330346B2Etching apparatus, method for measuring self-bias voltage, and method for monitoring etching apparatusHITACHI HIGH TECH CORP·Filed 2006·Granted Feb 12, 2008·6 cites·12 claims
- 2378US6911157B2Plasma processing method and apparatus using dynamic sensing of a plasma environmentHITACHI LTD·Filed 2003·Granted Jun 28, 2005·17 cites·11 claims
- 2478US6745096B2Maintenance method and system for plasma processing apparatus etching and apparatusHITACHI LTD·Filed 2001·Granted Jun 1, 2004·18 cites·11 claims
- 2578USD394404SWrist watchCASIO COMPUTER CO LTD·Filed 1997·Granted May 19, 1998·20 cites·1 claims
- 2677US6706543B2Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a thereforHITACHI LTD·Filed 2002·Granted Mar 16, 2004·13 cites·7 claims
- 2776US6881352B2Disturbance-free, recipe-controlled plasma processing methodHITACHI LTD·Filed 2003·Granted Apr 19, 2005·12 cites·3 claims
- 2876US6844275B2Heat-resistant fabric and method for production thereofTORAY INDUSTRIES·Filed 2001·Granted Jan 18, 2005·12 cites·5 claims
- 2976US6771481B2Plasma processing apparatus for processing semiconductor wafer using plasmaHITACHI LTD·Filed 2001·Granted Aug 3, 2004·19 cites·21 claims
- 3076USD390800SWatch bandCASIO COMPUTER CO LTD·Filed 1996·Granted Feb 17, 1998·19 cites·1 claims
- 3176USD378740SWrist watchCASIO COMPUTER CO LTD·Filed 1995·Granted Apr 8, 1997·19 cites·1 claims
- 3276US5404819AApparatus for cleaning printing press blanket cylinder and method for manufacturing the sameNIKKA LIMITED·Filed 1994·Granted Apr 11, 1995·21 cites·14 claims
- 3376USD325535SWrist watchCASIO COMPUTER CO LTD·Filed 1989·Granted Apr 21, 1992·15 cites·1 claims
- 3475US7058470B2Method of monitoring and/or controlling a semiconductor manufacturing apparatus and a system thereforHITACHI LTD·Filed 2004·Granted Jun 6, 2006·11 cites·9 claims
- 3575US7010374B2Method for controlling semiconductor processing apparatusHITACHI HIGH TECH CORP·Filed 2003·Granted Mar 7, 2006·15 cites·12 claims
- 3675US6923885B2Plasma processing system and apparatus and a sample processing methodHITACHI LTD·Filed 2003·Granted Aug 2, 2005·11 cites·19 claims
- 3773US6828165B2Semiconductor plasma processing apparatus with first and second processing state monitoring unitsHITACHI LTD·Filed 2003·Granted Dec 7, 2004·10 cites·3 claims
- 3872US6796269B2Apparatus and method for monitoring plasma processing apparatusHITCHI HIGH TECHNOLOGIES CORP·Filed 2002·Granted Sep 28, 2004·15 cites·5 claims
- 3972USD386975SWatch caseCASIO COMPUTER CO LTD·Filed 1996·Granted Dec 2, 1997·16 cites·1 claims
- 4071US7686917B2Plasma processing system and apparatus and a sample processing methodHITACHI LTD·Filed 2007·Granted Mar 30, 2010·2 cites·7 claims
- 4171US6653594B2Consumable electrode gas shielded arc welding method and apparatusJP MINISTRY OF EDUCATION CULTU·Filed 2001·Granted Nov 25, 2003·17 cites·8 claims
- 4270US7611993B2Plasma processing method and plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2007·Granted Nov 3, 2009·2 cites·2 claims
- 4370US6700090B2Plasma processing method and plasma processing apparatusHITACHI HIGH TECH CORP·Filed 2002·Granted Mar 2, 2004·9 cites·14 claims
- 4470US6537012B2Vacuum processing apparatus and a vacuum processing systemHITACHI LTD·Filed 2002·Granted Mar 25, 2003·11 cites·1 claims
- 4570US6297473B2Arc welding methodJP NAT RES INST FOR METALS·Filed 1999·Granted Oct 2, 2001·30 cites·6 claims
- 4668USD394610SWatch caseCASIO COMPUTER CO LTD·Filed 1997·Granted May 26, 1998·14 cites·1 claims
- 4766US7166480B2Particle control device and particle control method for vacuum processing apparatusHITACHI HIGH TECH CORP·Filed 2003·Granted Jan 23, 2007·10 cites·14 claims
- 4866US6747239B2Plasma processing apparatus and methodHITACHI LTD·Filed 2003·Granted Jun 8, 2004·8 cites·15 claims
- 4965US7009715B2Method and apparatus for determining endpoint of semiconductor element fabricating process and method and apparatus for processing member to be processedHITACHI LTD·Filed 2004·Granted Mar 7, 2006·7 cites·21 claims
- 5065US6776872B2Data processing apparatus for semiconductor processing apparatusHITACHI LTD·Filed 2002·Granted Aug 17, 2004·7 cites·8 claims
Showing the top 50 of 123 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →