Inventor · disambiguated record
Hiroyuki Yasuda
Also filed as: YASUDA HIROYUKI
102 granted patents·65 pending applications·465 citations·filing 1993–2025
99Inventor score
Files withSHINETSU CHEMICAL CO34SONY GROUP CORP22SONY CORP17HITACHI HIGH TECH CORP16YASUDA HIROYUKI10
Top patents by PatentIndex Score
167 records- 0193US10128143B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Nov 13, 2018·9 cites·15 claims
- 0291US11943457B2Information processing apparatus and methodSONY GROUP CORP·Filed 2020·Granted Mar 26, 2024·3 cites·16 claims
- 0391US9646868B2Wafer temporary bonding method and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2015·Granted May 9, 2017·7 cites·13 claims
- 0490US5511206AMicroprocessor based computer with virtual memory space in overwritable memorySONY CORP·Filed 1994·Granted Apr 23, 1996·157 cites·3 claims
- 0588US9934996B2Wafer processing bonding arrangement, wafer laminate, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 3, 2018·5 cites·12 claims
- 0687US8999817B2Wafer process body, wafer processing member, wafer processing temporary adhesive material, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Apr 7, 2015·7 cites·44 claims
- 0787US7158570B2Motion picture encoding apparatusSONY CORP·Filed 2002·Granted Jan 2, 2007·34 cites·9 claims
- 0886US9941145B2Wafer processing temporary bonding arrangement, wafer processing laminate, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2016·Granted Apr 10, 2018·4 cites·11 claims
- 0983US9006581B2Printed wiring board and method of manufacture thereofKAWAGUCHI TOSHIYUKI·Filed 2011·Granted Apr 14, 2015·6 cites·7 claims
- 1082US9884979B2Temporary adhesion method and method for producing thin waferSHINETSU CHEMICAL CO·Filed 2016·Granted Feb 6, 2018·3 cites·18 claims
- 1181US10658314B2Wafer laminate, method for production thereof, and adhesive composition for wafer laminateSHINETSU CHEMICAL CO·Filed 2017·Granted May 19, 2020·1 cites·9 claims
- 1281US9346990B2Temporary adhesive material for wafer processing, wafer processing laminate, and method for manufacturing thin wafer using sameSHINETSU CHEMICAL CO·Filed 2015·Granted May 24, 2016·3 cites·20 claims
- 1381US8829434B2Mass spectrometer and mass spectrometry methodYASUDA HIROYUKI·Filed 2011·Granted Sep 9, 2014·5 cites·20 claims
- 1480US12190549B2Information processing device and methodSONY GROUP CORP·Filed 2020·Granted Jan 7, 2025·1 cites·20 claims
- 1580US11302039B2Waveform analyzerSHIMADZU CORP·Filed 2017·Granted Apr 12, 2022·5 cites·15 claims
- 1680US9263333B2Wafer processing laminate, wafer processing member, temporary adhering material for processing wafer, and manufacturing method of thin waferSHINETSU CHEMICAL CO·Filed 2013·Granted Feb 16, 2016·4 cites·21 claims
- 1780US2025104289A1Information processing device and methodSONY GROUP CORP·Filed 2024·Application pending·0 cites
- 1879US7040963B1Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor waferIBIDEN CO LTD·Filed 2000·Granted May 9, 2006·19 cites·37 claims
- 1979US2024386616A1Information processing apparatus and methodSONY GROUP CORP·Filed 2024·Application pending·0 cites
- 2078US10000514B2Method for producing tetraalkoxysilaneAIST·Filed 2015·Granted Jun 19, 2018·2 cites·7 claims
- 2178US7529298B2Picture transmission method, picture transmission method program, storage medium which stores picture transmission method program, and picture transmission apparatusSONY CORP·Filed 2002·Granted May 5, 2009·14 cites·7 claims
- 2277US11991348B2Information processing device and methodSONY GROUP CORP·Filed 2020·Granted May 21, 2024·1 cites·22 claims
- 2377US10297485B2Semiconductor device, making method, and laminateSHINETSU CHEMICAL CO·Filed 2018·Granted May 21, 2019·2 cites·5 claims
- 2477US7115862B2Mass spectroscope and method of calibrating the sameHITACHI HIGH TECH CORP·Filed 2004·Granted Oct 3, 2006·10 cites·8 claims
- 2576US5611061AMethod and processor for reliably processing interrupt demands in a pipeline processorSONY CORP·Filed 1993·Granted Mar 11, 1997·68 cites·5 claims
- 2675US11922579B2Image processing apparatus and method for image processing by deriving voxel and mesh data to generate point cloud dataSONY CORP·Filed 2022·Granted Mar 5, 2024·0 cites·24 claims
- 2775US11486866B2Waveform analyzerSHIMADZU CORP·Filed 2017·Granted Nov 1, 2022·1 cites·10 claims
- 2875US8980525B2Chemically amplified positive resist composition and patterning processYASUDA HIROYUKI·Filed 2012·Granted Mar 17, 2015·8 cites·17 claims
- 2974US10242902B2Wafer processing laminate, temporary adhesive material for wafer processing, and method for manufacturing thin waferSHINETSU CHEMICAL CO·Filed 2015·Granted Mar 26, 2019·2 cites·15 claims
- 3074US8968982B2Chemically amplified positive resist composition and patterning processYASUDA HIROYUKI·Filed 2012·Granted Mar 3, 2015·3 cites·6 claims
- 3174US8655151B2Editing apparatus, editing method, program, and recording mediaYASUDA HIROYUKI·Filed 2011·Granted Feb 18, 2014·3 cites·19 claims
- 3274US2022008905A1Organometallic complex catalystAIST·Filed 2021·Application pending·0 cites
- 3374US2025278866A1Information processing device and methodSONY GROUP CORP·Filed 2025·Application pending·0 cites
- 3474US2022032278A1Organometallic complex catalystAIST·Filed 2021·Application pending·0 cites
- 3573US9834536B2Method for producing catalyst for cyclic carbonate synthesisAIST·Filed 2014·Granted Dec 5, 2017·2 cites·10 claims
- 3673US6872474B2Light emitting polymer composition, and organic electroluminescence device and production process thereofJSR CORP·Filed 2002·Granted Mar 29, 2005·16 cites·7 claims
- 3771US9550931B2Temporary adhesive material for wafer, film for temporary adhesion using same, wafer processing laminate, and method for producing thin wafer using sameSHINETSU CHEMICAL CO·Filed 2014·Granted Jan 24, 2017·2 cites·20 claims
- 3871US9096032B2Wafer processing laminate, wafer processing member, temporary bonding arrangement, and thin wafer manufacturing methodSHINETSU CHEMICAL CO·Filed 2013·Granted Aug 4, 2015·2 cites·23 claims
- 3971US2025320384A1Releasable addition-curable silicone composition for silicone adhesiveSHINETSU CHEMICAL CO·Filed 2023·Application pending·0 cites
- 4070US8735264B2Temporary adhesive composition and method for manufacturing thin wafer using the sameSHINETSU CHEMICAL CO·Filed 2012·Granted May 27, 2014·2 cites·10 claims
- 4170US2025142120A1Information processing device and methodSONY GROUP CORP·Filed 2025·Application pending·0 cites
- 4269US12231684B2Information processing device and methodSONY GROUP CORP·Filed 2020·Granted Feb 18, 2025·0 cites·19 claims
- 4369US11450518B2Mass spectrometer and chromatograph mass spectrometerSHIMADZU CORP·Filed 2017·Granted Sep 20, 2022·1 cites·6 claims
- 4469US2024422300A1Image processing device and methodSONY CORP·Filed 2024·Application pending·0 cites
- 4568US12250387B2Information processing apparatus and methodSONY GROUP CORP·Filed 2024·Granted Mar 11, 2025·0 cites·6 claims
- 4668US12073596B2Information processing apparatus and methodSONY GROUP CORP·Filed 2020·Granted Aug 27, 2024·0 cites·20 claims
- 4768US7560821B2Area mount type semiconductor device, and die bonding resin composition and encapsulating resin composition used for the sameSUMITOMO BAKELITE CO·Filed 2006·Granted Jul 14, 2009·6 cites·4 claims
- 4868US7381948B2Mass spectroscope and method of calibrating the sameHITACHI HIGH TECH CORP·Filed 2006·Granted Jun 3, 2008·1 cites·8 claims
- 4967US10373903B2Laminate and making methodSHINETSU CHEMICAL CO·Filed 2018·Granted Aug 6, 2019·0 cites·6 claims
- 5066US7989764B2Ion trap mass spectrometry methodHITACHI HIGH TECH CORP·Filed 2007·Granted Aug 2, 2011·1 cites·7 claims
Showing the top 50 of 167 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →