Inventor · disambiguated record
Hitoshi Yokono
Also filed as: KOBAYASHI TSUGUO · YOKONO HITOSHI
57 granted patents·1,883 citations·filing 1971–1994
99Inventor score
Top patents by PatentIndex Score
57 records- 0197US4128527ADynamoelectric machine having coil windings and core encapsulated with resin-filler compositionHITACHI LTD·Filed 1977·Granted Dec 5, 1978·98 cites·17 claims
- 0295US4495218AProcess for forming thin filmHITACHI LTD·Filed 1983·Granted Jan 22, 1985·121 cites·8 claims
- 0394US4963974AElectronic device plated with gold by means of an electroless gold plating solutionHITACHI LTD·Filed 1988·Granted Oct 16, 1990·74 cites·36 claims
- 0493US4387311AUninflammable dynamoelectric machine having coil windings and core encapsulated with unsaturated polyester resin-filler compositionHITACHI LTD·Filed 1981·Granted Jun 7, 1983·82 cites·14 claims
- 0592US4931726AApparatus for testing semiconductor deviceHITACHI LTD·Filed 1988·Granted Jun 5, 1990·90 cites·10 claims
- 0692US4484796AOptical fiber connectorHITACHI LTD·Filed 1981·Granted Nov 27, 1984·134 cites·9 claims
- 0789US4513132AHeat-resistant silicone block polymerHITACHI LTD·Filed 1983·Granted Apr 23, 1985·43 cites·7 claims
- 0887US4446185AReaction injection molded article with threads and method of molding sameHITACHI LTD·Filed 1982·Granted May 1, 1984·46 cites·15 claims
- 0987US4070416ANovel thermosetting resin and a process for producing sameHITACHI LTD·Filed 1975·Granted Jan 24, 1978·39 cites·48 claims
- 1085US4411609AApparatus for molding plasticHITACHI LTD·Filed 1981·Granted Oct 25, 1983·51 cites·10 claims
- 1184US4486232AElectrode material for semi-conductor devicesHITACHI LTD·Filed 1983·Granted Dec 4, 1984·47 cites·3 claims
- 1284US4321319APhotosensitive compositions containing polyamides acid with photosensitive groupsHITACHI LTD·Filed 1980·Granted Mar 23, 1982·34 cites·7 claims
- 1383US5569545ACopper clad laminate, multilayer printed circuit board and their processing methodNIPPON DENKAI LTD·Filed 1994·Granted Oct 29, 1996·71 cites·24 claims
- 1483US5388328AProcess for fabricating an interconnected multilayer boardHITACHI LTD·Filed 1994·Granted Feb 14, 1995·69 cites·64 claims
- 1582US4643913AProcess for producing solar cellsHITACHI LTD·Filed 1984·Granted Feb 17, 1987·48 cites·26 claims
- 1680US4451551ARadiation-sensitive poly(amic acid) polymer compositionHITACHI LTD·Filed 1981·Granted May 29, 1984·43 cites·21 claims
- 1779US4211686AUnsaturated polyester resin composition for use in pressure moldingHITACHI LTD·Filed 1977·Granted Jul 8, 1980·20 cites·19 claims
- 1878US4444704AProcess for producing integral skin polyurethane foamHITACHI LTD·Filed 1982·Granted Apr 24, 1984·26 cites·22 claims
- 1978US3984376AThermosetting resin compositions prepared from isocyanates and epoxyphenolsHITACHI LTD·Filed 1974·Granted Oct 5, 1976·21 cites·22 claims
- 2077US4303443AElectroless copper plating solutionHITACHI LTD·Filed 1980·Granted Dec 1, 1981·29 cites·11 claims
- 2176US4420500AComposition and process for preparing transparent conducting filmHITACHI LTD·Filed 1982·Granted Dec 13, 1983·33 cites·27 claims
- 2275US4273420ALiquid crystal display deviceHITACHI LTD·Filed 1979·Granted Jun 16, 1981·23 cites·5 claims
- 2374US5300735AInterconnected multilayer boards and fabrication processes thereofHITACHI LTD·Filed 1993·Granted Apr 5, 1994·42 cites·25 claims
- 2474US5133403ACooling arrangement for semiconductor devices and method of making the sameHITACHI LTD·Filed 1989·Granted Jul 28, 1992·44 cites·42 claims
- 2574US4324629AProcess for regenerating chemical copper plating solutionHITACHI LTD·Filed 1980·Granted Apr 13, 1982·26 cites·6 claims
- 2674US4303554AComposition and process for producing transparent conductive filmHITACHI LTD·Filed 1980·Granted Dec 1, 1981·28 cites·27 claims
- 2773US5162240AMethod and apparatus of fabricating electric circuit pattern on thick and thin film hybrid multilayer wiring substrateHITACHI LTD·Filed 1990·Granted Nov 10, 1992·47 cites·37 claims
- 2872US4753515AMethod for assembling flat type plastic multifiber connectorsHITACHI CONSTRUCTION MACHINERY·Filed 1986·Granted Jun 28, 1988·32 cites·2 claims
- 2970US4565767ALight-sensitive polymer composition with poly(amic acid), bisazide, and tertiary amine compoundHITACHI LTD·Filed 1984·Granted Jan 21, 1986·24 cites·11 claims
- 3070US4369208AProcess for producing transparent electroconductive filmHITACHI LTD·Filed 1980·Granted Jan 18, 1983·25 cites·5 claims
- 3170US4138372AResin compositions containing polyepoxides and uretdionesHITACHI LTD·Filed 1976·Granted Feb 6, 1979·18 cites·16 claims
- 3269US5202151AElectroless gold plating solution, method of plating with gold by using the same, and electronic device plated with gold by using the sameHITACHI LTD·Filed 1990·Granted Apr 13, 1993·29 cites·14 claims
- 3368US4804559AElectroless gold plating solutionHITACHI LTD·Filed 1987·Granted Feb 14, 1989·17 cites·13 claims
- 3467US3960982AThermosetting resinsHITACHI LTD·Filed 1974·Granted Jun 1, 1976·15 cites·9 claims
- 3566US4554237APhotosensitive resin composition and method for forming fine patterns with said compositionHITACHI LTD·Filed 1982·Granted Nov 19, 1985·22 cites·17 claims
- 3665US3963796AEpoxy resin composition having excellent latent hardening characteristicsHITACHI LTD·Filed 1971·Granted Jun 15, 1976·12 cites·8 claims
- 3762US4908696AConnector and semiconductor device packages employing the sameHITACHI LTD·Filed 1987·Granted Mar 13, 1990·30 cites·18 claims
- 3858US4544729APhoto and radiation-sensitive organopolymeric materialHITACHI LTD·Filed 1984·Granted Oct 1, 1985·14 cites·6 claims
- 3956US5198273AElectroless gold plating solution and method for plating gold therewithHITACHI LTD·Filed 1990·Granted Mar 30, 1993·17 cites·14 claims
- 4056US4342842AProcess for producing rigid polyurethane foamHITACHI LTD·Filed 1981·Granted Aug 3, 1982·12 cites·14 claims
- 4156US4100118AThermosetting resin compositionHITACHI LTD·Filed 1975·Granted Jul 11, 1978·10 cites·29 claims
- 4254US4347304AProcess for forming metallic imageHITACHI LTD·Filed 1981·Granted Aug 31, 1982·14 cites·8 claims
- 4353US5208656AMultilayer wiring substrate and production thereofHITACHI LTD·Filed 1991·Granted May 4, 1993·23 cites·17 claims
- 4453US4927044AHeat insulating case and process for preparing the sameHITACHI LTD·Filed 1985·Granted May 22, 1990·15 cites·16 claims
- 4552US4963512AMethod for forming conductor layers and method for fabricating multilayer substratesHITACHI LTD·Filed 1988·Granted Oct 16, 1990·19 cites·10 claims
- 4652US4880464AElectroless gold plating solutionHITACHI LTD·Filed 1988·Granted Nov 14, 1989·9 cites·17 claims
- 4749US4736012ASemiconductor deviceHITACHI LTD·Filed 1984·Granted Apr 5, 1988·13 cites·12 claims
- 4849US4530746APhotosensitive resin compositionHITACHI LTD·Filed 1983·Granted Jul 23, 1985·9 cites·15 claims
- 4948US4587197AFlexible photosensitive polymer composition with azide and/or amine compound, poly(amic acid) and highly polar compound with boiling point above 150° C.HITACHI LTD·Filed 1984·Granted May 6, 1986·11 cites·14 claims
- 5048US4478902AScreen for projection televisionHITACHI LTD·Filed 1981·Granted Oct 23, 1984·13 cites·16 claims
Showing the top 50 of 57 patent records by PatentIndex Score.
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