Inventor · disambiguated record
His-Ying Yuan
Also filed as: YUAN HIS-YING
3 granted patents·35 citations·filing 2004–2005
71Inventor score
Technology areasH10W
Top patents by PatentIndex Score
3 records- 0189US7279782B2FBGA and COB package structure for image sensorADVANCED CHIP ENG TECH INC·Filed 2005·Granted Oct 9, 2007·21 cites·25 claims
- 0259US7525139B2Image sensor with a protection layerADVANCED CHIP ENG TECH INC·Filed 2004·Granted Apr 28, 2009·7 cites·8 claims
- 0352US7400037B2Packaging structure with coplanar filling paste and dice and with patterned glue for WL-CSPADVANCED CHIP ENGINEERING TACH·Filed 2004·Granted Jul 15, 2008·7 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →