Inventor · disambiguated record

Ho-Eun Bae

Also filed as: BAE HO-EUN

1 granted patent·0 citations·filing 2013–2013

11Inventor score

Technology areasH10W

Files withKOREA ELECTRONICS TELECOMM1

Top patents by PatentIndex Score

1 record

0140US9034750B2Method of fabricating a solder-on-pad structure and flip-chip bonding method using the sameKOREA ELECTRONICS TELECOMM·Filed 2013·Granted May 19, 2015·0 cites·13 claims

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