Inventor · disambiguated record
Hongliang Cai
Also filed as: CAI HONGLIANG
2 granted patents·1 pending application·1 citations·filing 2012–2019
33Inventor score
Top patents by PatentIndex Score
3 records- 0164US10304792B1Semiconductor package having reduced internal power pad pitchFUTUREWEI TECHNOLOGIES INC·Filed 2017·Granted May 28, 2019·1 cites·9 claims
- 0252US10672730B2Semiconductor package having reduced internal power pad pitchFUTUREWEI TECHNOLOGIES INC·Filed 2019·Granted Jun 2, 2020·0 cites·20 claims
- 0329US2014057066A1Building boards and method for manufacturing the sameCAI HONGLIANG·Filed 2012·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →