Inventor · disambiguated record
Hong-Wei Chan
Also filed as: CHAN HONG-WEI
8 granted patents·5 pending applications·2 citations·filing 2020–2025
75Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD13
Top patents by PatentIndex Score
13 records- 0192US12094930B2Integrated circuit structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 17, 2024·2 cites·20 claims
- 0279US12230603B2Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Feb 18, 2025·0 cites·20 claims
- 0376US2024371757A1Structure and method of forming a semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0473US12074107B2Structure and method of forming a semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Aug 27, 2024·0 cites·20 claims
- 0573US2024387630A1Integrated circuit structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0673US2024395728A1Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0772US2025183225A1Method of fabricating a semiconductor chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0870US2024145430A1Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 0969US11756924B2Method of fabricating a semiconductor chip having strength adjustment pattern in bonding layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 1067US11437313B2Structure and method of forming a semiconductor device with resistive elementsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 1165US12142574B2Semiconductor devices and methods of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 12, 2024·0 cites·20 claims
- 1265US11908829B2Integrated circuit package and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 1358US11923295B2Interconnect level with high resistance layer and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 5, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →