Inventor · disambiguated record
Hock Heng Chong
Also filed as: CHONG HOCK HENG
4 granted patents·3 pending applications·6 citations·filing 2016–2024
66Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG7
Top patents by PatentIndex Score
7 records- 0174US10431560B2Molded semiconductor package having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2017·Granted Oct 1, 2019·2 cites·21 claims
- 0272US9806043B2Method of manufacturing molded semiconductor packages having an optical inspection featureINFINEON TECHNOLOGIES AG·Filed 2016·Granted Oct 31, 2017·2 cites·13 claims
- 0368US10777536B2Semiconductor package with air cavityINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·2 cites·22 claims
- 0457US2024274563A1Solder structure with disruptable coating as solder spreading protectionINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0552US2020006267A1Molded Semiconductor PackageINFINEON TECHNOLOGIES AG·Filed 2019·Application pending·0 cites
- 0650US2024186152A1Chip package and method including encapsulating spaced chips by locally curable materialINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0740US10490470B2Semiconductor package and method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2017·Granted Nov 26, 2019·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →