Inventor · disambiguated record
Hock Siang Chua
Also filed as: CHUA HOCK SIANG
2 granted patents·14 citations·filing 2015–2019
50Inventor score
Technology areasH10W
Files withINFINEON TECHNOLOGIES AG2
Top patents by PatentIndex Score
2 records- 0190US9475691B1Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs deviceINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 25, 2016·14 cites·20 claims
- 0236US10770399B2Semiconductor package having a filled conductive cavityINFINEON TECHNOLOGIES AG·Filed 2019·Granted Sep 8, 2020·0 cites·17 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →