Inventor · disambiguated record
Hongde Dai
Also filed as: DAI HONGDE
0 granted patents·2 pending applications·0 citations·filing 2023–2023
Technology areasH10W
Top patents by PatentIndex Score
2 records- 0151US2024006370A1Chip package with heat dissipation plate and manufacturing method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2023·Application pending·0 cites
- 0251US2024006339A1Chip package with heat dissipation plate and manufacturing method thereofSTATS CHIPPAC SEMICONDUCTOR JIANGYIN CO LTD·Filed 2023·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →