Inventor · disambiguated record
Hongxia Feng
Also filed as: FENG HONGXIA
11 granted patents·69 pending applications·6 citations·filing 2017–2025
81Inventor score
Top patents by PatentIndex Score
80 records- 0193US11676891B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2021·Granted Jun 13, 2023·2 cites·20 claims
- 0286US11088062B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2017·Granted Aug 10, 2021·4 cites·14 claims
- 0376US12230563B2Method to enable 30 microns pitch EMIB or belowINTEL CORP·Filed 2022·Granted Feb 18, 2025·0 cites·21 claims
- 0475US2025149433A1New method to enable 30 microns pitch emib or belowINTEL CORP·Filed 2025·Application pending·0 cites
- 0561US2025132239A1Porous liners for through-glass vias and associated methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0661US2025105074A1Glass cores including protruding through glass vias and related methodsINTEL CORP·Filed 2024·Application pending·0 cites
- 0758US12341117B2Methods and apparatus to reduce defects in interconnects between semiconductor dies and package substratesINTEL CORP·Filed 2021·Granted Jun 24, 2025·0 cites·25 claims
- 0858US2025218999A1Passive component assembly for thickness modification to match core thicknessINTEL CORP·Filed 2023·Application pending·0 cites
- 0958US2025218998A1Low temperature solder interconnect for package pitch scalingINTEL CORP·Filed 2023·Application pending·0 cites
- 1058US2025279384A1Methods and apparatus using polymer material to fill gaps between semiconductor diesINTEL CORP·Filed 2024·Application pending·0 cites
- 1157US12354883B2Omni directional interconnect with magnetic fillers in mold matrixINTEL CORP·Filed 2021·Granted Jul 8, 2025·0 cites·18 claims
- 1257US2025219028A1Deep trench capacitors in multi-core integrated circuit device package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 1357US2025210426A1Microelectronic assemblies with strengthened glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 1457US2025112124A1Deep cavity arrangements on integrated circuit packagingINTEL CORP·Filed 2023·Application pending·0 cites
- 1557US2025220818A1Flow enhanced dummy structure to enable capillary flow based sidewall fillingINTEL CORP·Filed 2023·Application pending·0 cites
- 1657US2025218964A1Technologies for connected components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1757US2025218958A1Pedestals for semiconductor components embedded in package substrates and related methodsINTEL CORP·Filed 2023·Application pending·0 cites
- 1857US2025218904A1Technologies for power and spacer components embedded in a substrate coreINTEL CORP·Filed 2023·Application pending·0 cites
- 1957US2025218880A1Microelectronic assemblies with pillar-first conductive via formation in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2057US2025218960A1Methods and apparatus to embed semiconductor devices in cores of package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2157US2025218926A1Microelectronic assemblies including cavity-less encapsulated diesINTEL CORP·Filed 2023·Application pending·0 cites
- 2256US11923312B2Patternable die attach materials and processes for patterningINTEL CORP·Filed 2019·Granted Mar 5, 2024·0 cites·12 claims
- 2356US2025273607A1Methods and architectures for shallow fiducial and metal defined pad designsINTEL CORP·Filed 2024·Application pending·0 cites
- 2456US2025219021A1Vertically embedded components in package substratesINTEL CORP·Filed 2023·Application pending·0 cites
- 2556US2025112085A1Apparatus and methods for capillary underfill of embedded devicesINTEL CORP·Filed 2023·Application pending·0 cites
- 2656US2025183180A1Direct bonding for embedded bridges with viasINTEL CORP·Filed 2023·Application pending·0 cites
- 2756US2025218957A1Methods and apparatus to embed a semiconductor device in a glass coreINTEL CORP·Filed 2023·Application pending·0 cites
- 2855US2025218906A1Reconstituted passive assemblies for embedding in thick coresINTEL CORP·Filed 2023·Application pending·0 cites
- 2955US2025113434A1Through glass via (tgv) with modulated profile for core stress reductionINTEL CORP·Filed 2023·Application pending·0 cites
- 3055US2025106983A1Stiffener architectures for glass edge protectionINTEL CORP·Filed 2023·Application pending·0 cites
- 3155US2025192069A1Microelectronic assemblies with pre-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3255US2025112164A1Controlling substrate bump heightINTEL CORP·Filed 2023·Application pending·0 cites
- 3355US2024243087A1Methods and apparatus to reduce variation in height of bumps after reflowINTEL CORP·Filed 2024·Application pending·0 cites
- 3455US2025192070A1Microelectronic assemblies with post-singulation edge features in glass coresINTEL CORP·Filed 2023·Application pending·0 cites
- 3554US2024222301A1Methods and apparatus for optical thermal treatment in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 3654US2024222136A1Electrical layer with roughened surfacesINTEL CORP·Filed 2022·Application pending·0 cites
- 3754US2024312865A1Methods, systems, apparatus, and articles of manufacture to improve reliability of vias in a glass substrate of an integrated circuit packageINTEL CORP·Filed 2023·Application pending·0 cites
- 3854US2024332125A12d fillers for reduced cte for pidINTEL CORP·Filed 2023·Application pending·0 cites
- 3953US2025349729A1Microelectronic assemblies with double liners in through-glass viasINTEL CORP·Filed 2024·Application pending·0 cites
- 4053US2024213116A1Methods, systems, apparatus, and articles of manufacture to cool integrated circuit packages having glass substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 4153US2024213169A1Low die height glass substrate device and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4253US2024222210A1Glass substrate fabrication using hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4353US2024222238A1Apparatus and method for attaching an optical component using no remelt metallurgyINTEL CORP·Filed 2022·Application pending·0 cites
- 4453US2024219660A1Optical semiconductor package and methodINTEL CORP·Filed 2022·Application pending·0 cites
- 4553US2024222345A1Die attach in glass core package through organic-to-organic bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4653US2024112971A1Singulation of integrated circuit package substrates with glass coresINTEL CORP·Filed 2022·Application pending·0 cites
- 4753US2024222243A1Apparatus and method for attaching an optical component using hybrid bondingINTEL CORP·Filed 2022·Application pending·0 cites
- 4853US2024222304A1Methods and apparatus to reduce solder bump bridging between two substratesINTEL CORP·Filed 2022·Application pending·0 cites
- 4953US2025192059A1Embedded bridge with through silicon via bonding architecturesINTEL CORP·Filed 2023·Application pending·0 cites
- 5053US2025006645A1Microelectronic assemblies including a photoimageable dielectric for hybrid bonding and die encapsulationINTEL CORP·Filed 2023·Application pending·0 cites
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →