Inventor · disambiguated record
Horst Groeninger
Also filed as: GROENINGER HORST
11 granted patents·3 pending applications·13 citations·filing 2004–2024
82Inventor score
Top patents by PatentIndex Score
14 records- 0177US9079318B2Self-aligning pick-up head and method for manufacturing a device with the self-aligning pick-up headINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 14, 2015·4 cites·17 claims
- 0272US2025125218A1Electronic module having a clip connected to a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0364US7768284B2Test apparatus for testing a semiconductor device, and method for testing the semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2005·Granted Aug 3, 2010·5 cites·22 claims
- 0464US7485493B2Singulating surface-mountable semiconductor devices and fitting external contacts to said devicesINFINEON TECHNOLOGIES AG·Filed 2007·Granted Feb 3, 2009·2 cites·20 claims
- 0559US12218030B2Electronic module comprising a semiconductor package with integrated clip and fastening elementINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Feb 4, 2025·0 cites·2 claims
- 0658US10041973B2Method and apparatus for dynamic alignment of semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2013·Granted Aug 7, 2018·1 cites·18 claims
- 0758US7999362B2Method and apparatus for making semiconductor devices including a foilINFINEON TECHNOLOGIES AG·Filed 2008·Granted Aug 16, 2011·1 cites·12 claims
- 0842US9595502B2Spring contact for semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2015·Granted Mar 14, 2017·0 cites·19 claims
- 0942US9395404B2Method for testing semiconductor chips or semiconductor chip modulesINFINEON TECHNOLOGIES AG·Filed 2012·Granted Jul 19, 2016·0 cites·12 claims
- 1041US7705438B2Electronic component and leadframe for producing the componentINFINEON TECHNOLOGIES AG·Filed 2006·Granted Apr 27, 2010·0 cites·8 claims
- 1138US7709379B2Electrical device comprising conductors made of carbonized plastic, and method and apparatus for the production thereofINFINEON TECHNOLOGIES AG·Filed 2004·Granted May 4, 2010·0 cites·6 claims
- 1237US7642104B2Method for contacting semiconductor components with a test contactINFINEON TECHNOLOGIES AG·Filed 2006·Granted Jan 5, 2010·0 cites·11 claims
- 1334US2005140009A1Method and apparatus for the production of an electronic component with external contact areasFiled 2004·Application pending·0 cites
- 1433US2004257230A1Integrated circuit packages with marked product tracking informationFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →