Inventor · disambiguated record

Hosoo Han

Also filed as: HAN HOSOO

1 granted patent·1 pending application·0 citations·filing 2018–2021

3Inventor score

Technology areasH10W

Files withSAMSUNG ELECTRONICS CO LTD2

Top patents by PatentIndex Score

2 records

0137US11594503B2Wire bonding method for semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 28, 2023·0 cites·19 claims
0233US2019157237A1Semiconductor devices having wire bonding structures and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2018·Application pending·0 cites

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →