Inventor · disambiguated record

Honda Huang

Also filed as: HUANG HONDA

2 granted patents·11 citations·filing 1997–2004

49Inventor score

Technology areasG01R H10W

Files withVIA TECH INC1 WINBOND ELECTRONICS CORP1

Top patents by PatentIndex Score

2 records

0138US6051984AWafer-level method of hot-carrier reliability test for semiconductor wafersWINBOND ELECTRONICS CORP·Filed 1997·Granted Apr 18, 2000·11 cites·17 claims
0233US6975002B2SOI single crystalline chip structureVIA TECH INC·Filed 2004·Granted Dec 13, 2005·0 cites·19 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →