Inventor · disambiguated record
How Yuan Hwang
Also filed as: HWANG HOW YUAN
6 granted patents·2 pending applications·8 citations·filing 2010–2016
73Inventor score
Technology areasH10W
Files withST MICROELECTRONICS PTE LTD3AGENCY SCIENCE TECH & RES2HUANG YAOHUANG1HWANG HOW YUAN1RAMASAMY ANANDAN1
Top patents by PatentIndex Score
8 records- 0172US8922013B2Through via packageHWANG HOW YUAN·Filed 2011·Granted Dec 30, 2014·5 cites·13 claims
- 0266US9318459B2Through via packageST MICROELECTRONICS PTE LTD·Filed 2014·Granted Apr 19, 2016·2 cites·12 claims
- 0356US9431315B2Chemical sensor package for highly pressured environmentAGENCY SCIENCE TECH & RES·Filed 2014·Granted Aug 30, 2016·1 cites·8 claims
- 0443US9841399B2Chemical sensor package for highly pressured environmentAGENCY SCIENCE TECH & RES·Filed 2016·Granted Dec 12, 2017·0 cites·9 claims
- 0543US8836117B2Electronic device having a contact recess and related methodsST MICROELECTRONICS PTE LTD·Filed 2012·Granted Sep 16, 2014·0 cites·22 claims
- 0634US8822267B2System in package manufacturing method using wafer-to-wafer bondingST MICROELECTRONICS PTE LTD·Filed 2012·Granted Sep 2, 2014·0 cites·20 claims
- 0734US2014057394A1Method for making a double-sided fanout semiconductor package with embedded surface mount devices, and product madeRAMASAMY ANANDAN·Filed 2012·Application pending·0 cites
- 0831US2012161319A1Ball grid array method and structureHUANG YAOHUANG·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →