Inventor · disambiguated record
Ho-Soo Jang
Also filed as: JANG HO-SOO
2 granted patents·2 pending applications·5 citations·filing 2007–2012
42Inventor score
Top patents by PatentIndex Score
4 records- 0159US8132305B2Equipment and method for cutting packageCHOI TAI-KEW·Filed 2007·Granted Mar 13, 2012·5 cites·28 claims
- 0239US8316531B2Semiconductor device fabrication processJANG HO-SOO·Filed 2009·Granted Nov 27, 2012·0 cites·18 claims
- 0334US2012225150A1Molding apparatus for semiconductor packageHAN DONG-CHUL·Filed 2012·Application pending·0 cites
- 0428US2011171338A1Apparatus and method for molding compoundHAN DONGCHUL·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →