Inventor · disambiguated record
Hongjin Jiang
Also filed as: JIANG HONGJIN
4 granted patents·6 pending applications·19 citations·filing 2004–2023
67Inventor score
Top patents by PatentIndex Score
10 records- 0185US8920934B2Hybrid solder and filled paste in microelectronic packagingJIANG HONGJIN·Filed 2013·Granted Dec 30, 2014·17 cites·16 claims
- 0277US12113157B2Methods of modifying the composition of material layersTECTUS CORP·Filed 2023·Granted Oct 8, 2024·0 cites·13 claims
- 0353US8575539B2Detection apparatus and methodMOSLEY ALAN·Filed 2008·Granted Nov 5, 2013·1 cites·28 claims
- 0451US2020135988A1Methods of modifying the composition of material layersTECTUS CORP·Filed 2018·Application pending·0 cites
- 0544US7490999B2Hermetic and near hermetic sealing of optical componentsFINISAR CORP·Filed 2004·Granted Feb 17, 2009·1 cites·20 claims
- 0643US2008272344A1Conductive polymer compositesGEORGIA TECH RES INST·Filed 2008·Application pending·0 cites
- 0739US2016260679A1Hybrid interconnect for low temperature attachINTEL CORP·Filed 2014·Application pending·0 cites
- 0831US2014151096A1Low temperature/high temperature solder hybrid solder interconnectsJIANG HONGJIN·Filed 2012·Application pending·0 cites
- 0929US2017053858A1Substrate on substrate packageINTEL CORP·Filed 2015·Application pending·0 cites
- 1029US2016268213A1On Package Floating Metal/Stiffener Grounding to Mitigate RFI and SI RisksINTEL CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →