Inventor · disambiguated record
Hongfeng Jin
Also filed as: JIN HONGFENG
3 granted patents·2 pending applications·4 citations·filing 2018–2023
53Inventor score
Top patents by PatentIndex Score
5 records- 0180US11158737B2LDMOS component, manufacturing method therefor, and electronic deviceCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2018·Granted Oct 26, 2021·4 cites·16 claims
- 0248US12451357B2Semiconductor device and manufacturing method thereforCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2021·Granted Oct 21, 2025·0 cites·10 claims
- 0346US2023420496A1Digital Isolator Structure and Method for Forming the SameHUA HONG SEMICONDUCTOR WUXI LTD·Filed 2023·Application pending·0 cites
- 0445US2024234520A9Laterally diffused metal oxide semiconductor device and preparation method thereforCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2021·Application pending·0 cites
- 0541US11476324B2MIM capacitor and manufacturing method thereforCSMC TECHNOLOGIES FAB2 CO LTD·Filed 2019·Granted Oct 18, 2022·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →