Inventor · disambiguated record
Hooi San Lam
Also filed as: LAM HOOI SAN
0 granted patents·3 pending applications·0 citations·filing 2022–2023
Technology areasH10W
Files withINTEL CORP3
Top patents by PatentIndex Score
3 records- 0155US2024355792A1Reversed overhang memory on package (mop) architectureINTEL CORP·Filed 2023·Application pending·0 cites
- 0253US2024113033A1Dynamic random-access memory in a molding beneath a dieINTEL CORP·Filed 2022·Application pending·0 cites
- 0351US2023369232A1Molded interconnect memory on packageINTEL CORP·Filed 2022·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →