Inventor · disambiguated record
Ho-Jin Lee
Also filed as: LEE HO · LEE HO SOO · LEE HO-JIN
210 granted patents·85 pending applications·1,665 citations·filing 1990–2025
99Inventor score
Files withSAMSUNG ELECTRONICS CO LTD100KOREA ELECTRONICS TELECOMM44LEE HO JIN23ELECTRONICS & TELECOMMUNICATIONS RES INST15NAVER BUSINESS PLATFORM CORP12
Top patents by PatentIndex Score
295 records- 0198US9941243B2Wafer-to-wafer bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 10, 2018·237 cites·20 claims
- 0297US8592991B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·31 cites·30 claims
- 0397US7952147B2Semiconductor device having analog transistor with improved operating and flicker noise characteristics and method of making sameSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted May 31, 2011·122 cites·12 claims
- 0497US7361563B2Methods of fabricating a semiconductor device using a selective epitaxial growth techniqueSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 22, 2008·94 cites·26 claims
- 0595US10577199B2Robot cleaner, refrigerator, container transfer system, and method of transferring and retrieving container using the robot cleanerSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Mar 3, 2020·20 cites·20 claims
- 0694US9935037B2Multi-stacked device having TSV structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 3, 2018·13 cites·20 claims
- 0794US9859191B2Semiconductor device including conductive via with buffer layer at tapered portion of conductive viaLEE HO-JIN·Filed 2016·Granted Jan 2, 2018·12 cites·11 claims
- 0894US7616710B2Frequency offset estimating method and receiver employing the sameKOREA ELECTRONICS TELECOMM·Filed 2005·Granted Nov 10, 2009·57 cites·12 claims
- 0993US10639875B2Wafer bonding apparatus and wafer bonding system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 5, 2020·6 cites·20 claims
- 1093US10543754B2Charging control apparatus and method for electric vehicle and billing system using the sameHYUNDAI MOTOR CO LTD·Filed 2017·Granted Jan 28, 2020·16 cites·15 claims
- 1193US9530706B2Semiconductor devices having hybrid stacking structures and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·13 cites·17 claims
- 1293US8592988B2Semiconductor deviceLEE HO-JIN·Filed 2011·Granted Nov 26, 2013·19 cites·11 claims
- 1392US10468400B2Method of manufacturing substrate structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 5, 2019·8 cites·19 claims
- 1492US9343361B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted May 17, 2016·11 cites·16 claims
- 1592US9318573B2Field effect transistor having germanium nanorod and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 19, 2016·15 cites·13 claims
- 1692US8952543B2Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devicesLEE HO-JIN·Filed 2012·Granted Feb 10, 2015·15 cites·25 claims
- 1792US7572673B2Wafer level package having a stress relief spacer and manufacturing method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Aug 11, 2009·18 cites·14 claims
- 1892US7354835B2Method of fabricating CMOS transistor and CMOS transistor fabricated therebySAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 8, 2008·26 cites·16 claims
- 1991US10325869B2Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 18, 2019·6 cites·20 claims
- 2090US9824973B2Integrated circuit devices having through-silicon via structures and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Nov 21, 2017·7 cites·25 claims
- 2189US11502555B2System and method for wireless power transmissionELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2021·Granted Nov 15, 2022·2 cites·13 claims
- 2289US9941196B2Semiconductor device, fabricating method thereof and semiconductor package including the semiconductor deviceLEE HO JIN·Filed 2016·Granted Apr 10, 2018·5 cites·16 claims
- 2389US8335255B2Motion estimation method, medium, and system with fast motion estimationLEE HO-JIN·Filed 2007·Granted Dec 18, 2012·13 cites·17 claims
- 2489US7671420B2Semiconductor devices having faceted channels and methods of fabricating such devicesSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Mar 2, 2010·28 cites·17 claims
- 2589US7385247B2At least penta-sided-channel type of FinFET transistorSAMSUNG ELECTRONICS CO LTD·Filed 2004·Granted Jun 10, 2008·46 cites·27 claims
- 2689US6385990B1Food preparation table with open top food containersDAEWOO ELECTRONICS CO LTD·Filed 2001·Granted May 14, 2002·55 cites·8 claims
- 2788US9852965B2Semiconductor devices with through electrodes and methods of fabricating the sameLEE HO-JIN·Filed 2016·Granted Dec 26, 2017·6 cites·20 claims
- 2888US9806004B2Semiconductor devices having a TSV, a front-side bumping pad, and a back-side bumping padSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 31, 2017·8 cites·19 claims
- 2988US8927426B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·10 cites·14 claims
- 3088US8637989B2Semiconductor chip having via electrodes and stacked semiconductor chips interconnected by the via electrodesLEE HO-JIN·Filed 2012·Granted Jan 28, 2014·9 cites·5 claims
- 3187US10325897B2Method for fabricating substrate structure and substrate structure fabricated by using the methodSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Jun 18, 2019·4 cites·20 claims
- 3287US8941216B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 27, 2015·7 cites·7 claims
- 3387US7723193B2Method of forming an at least penta-sided-channel type of FinFET transistorSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted May 25, 2010·13 cites·16 claims
- 3487US7324465B2Random access channel access apparatus for mobile satellite communication system and method thereforKOREA ELECTRONICS TELECOMM·Filed 2001·Granted Jan 29, 2008·47 cites·57 claims
- 3586US10171942B2Methods, apparatuses, systems, and computer readable media for changing settings of mobile terminals using cell identification informationNAVER BUSINESS PLATFORM CORP·Filed 2015·Granted Jan 1, 2019·6 cites·17 claims
- 3686US8665771B2Satellite mobile communication systems considering evolution of satellite mobile communication services market and method for communication using the systemNAM SEUNG HYUN·Filed 2011·Granted Mar 4, 2014·14 cites·10 claims
- 3786US6372383B1Method for preparing electrodes for Ni/Metal hydride secondary cells using CuKOREA ADVANCED INST SCI & TECH·Filed 2000·Granted Apr 16, 2002·29 cites·19 claims
- 3885US8426252B2Wafer level package having a stress relief spacer and manufacturing method thereofCHUNG HYUN-SOO·Filed 2012·Granted Apr 23, 2013·5 cites·16 claims
- 3985US8362621B2Microelectronic devices including multiple through-silicon via structures on a conductive pad and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 29, 2013·14 cites·30 claims
- 4085US7601983B2Transistor and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Oct 13, 2009·13 cites·19 claims
- 4184US10082627B2Apparatus and method for providing terahertz wavesELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2017·Granted Sep 25, 2018·4 cites·11 claims
- 4284US8492902B2Multi-layer TSV insulation and methods of fabricating the sameLEE HO-JIN·Filed 2011·Granted Jul 23, 2013·8 cites·14 claims
- 4384US7777345B2Semiconductor device having through electrode and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Aug 17, 2010·12 cites·12 claims
- 4484US7611951B2Method of fabricating MOS transistor having epitaxial regionSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 3, 2009·9 cites·23 claims
- 4583US11955271B2Radio frequency weak magnetic field detection sensor and method of manufacturing the sameELECTRONICS & TELECOMMUNICATIONS RES INST·Filed 2023·Granted Apr 9, 2024·0 cites·4 claims
- 4683US10833032B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 10, 2020·3 cites·20 claims
- 4783US9236349B2Semiconductor device including through via structures and redistribution structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 12, 2016·6 cites·20 claims
- 4883US9171753B2Semiconductor devices having conductive via structures and methods for fabricating the sameLEE HO-JIN·Filed 2013·Granted Oct 27, 2015·7 cites·19 claims
- 4982US11469202B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·1 cites·20 claims
- 5082US10580726B2Semiconductor devices and semiconductor packages including the same, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Mar 3, 2020·3 cites·20 claims
Showing the top 50 of 295 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →