Inventor · disambiguated record
Hoon Lee
Also filed as: LEE HOON · LEE HOON-CHI
9 granted patents·1 pending application·480 citations·filing 2001–2017
88Inventor score
Top patents by PatentIndex Score
10 records- 0197US7457181B2Memory device and method of operating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Nov 25, 2008·413 cites·25 claims
- 0289US9245827B23D semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Jan 26, 2016·9 cites·21 claims
- 0386US9985619B2Duty cycle corrector, semiconductor device including the same, and method of operating duty cycle correctorSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted May 29, 2018·8 cites·15 claims
- 0482US10305494B2Delay locked loop including a delay code generatorSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 28, 2019·4 cites·13 claims
- 0581US6825091B2Semiconductor memory device and method of manufacturing sameSAMSUNG ELECTRONICS CO LTD·Filed 2003·Granted Nov 30, 2004·29 cites·13 claims
- 0678US9118313B2Semiconductor memory device calibrating termination resistance and termination resistance calibration method thereofSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Aug 25, 2015·6 cites·20 claims
- 0765US6548851B2Semiconductor memory device with increased level of integrationSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 15, 2003·11 cites·14 claims
- 0850US9190357B2Multi chip package, manufacturing method thereof, and memory system having the multi chip packageSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Nov 17, 2015·0 cites·8 claims
- 0947US9041219B2Multi chip package, manufacturing method thereof, and memory system having the multi chip packageLEE BYUNG-HYUN·Filed 2012·Granted May 26, 2015·0 cites·9 claims
- 1046US2010001379A1Multi-chip package (MCP) having three dimensional mesh-based power distribution network, and power distribution method of the MCPLEE HOON·Filed 2009·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →