Inventor · disambiguated record
Hong-Wen Lee
Also filed as: LEE HONG WEN
3 granted patents·3 pending applications·4 citations·filing 2006–2022
53Inventor score
Top patents by PatentIndex Score
6 records- 0163US7170740B1Foldable support structureCOMPAL ELECTRONICS INC·Filed 2006·Granted Jan 30, 2007·4 cites·5 claims
- 0247US2010213649A1Shock Absorber and Assembling Method of Electronic Device Using the SameCOMPAL ELECTRONICS INC·Filed 2009·Application pending·0 cites
- 0339US12149024B2Electrical connector assemblyLIN CHUN CHENG·Filed 2022·Granted Nov 19, 2024·0 cites·18 claims
- 0437US2008303103A1Semiconductor structure and method of forming the sameNANYA TECHNOLOGY CORP·Filed 2007·Application pending·0 cites
- 0535US7713855B2Method for forming bit-line contact plug and transistor structureNANYA TECHNOLOGY CORP·Filed 2007·Granted May 11, 2010·0 cites·18 claims
- 0633US2009061588A1Method for fabricating dynamic random access memoryNANYA TECHNOLOGY CORP·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →