Inventor · disambiguated record
Hoe Kit Liew How Kat Ley
Also filed as: LEY HOE KIT LIEW HOW KAT · LEY HOE KIT LIEW HOW KIAT
4 granted patents·0 citations·filing 2017–2020
60Inventor score
Files withSEMICONDUCTOR COMPONENTS IND LLC4
Top patents by PatentIndex Score
4 records- 0168US10971429B2Method for forming a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Apr 6, 2021·0 cites·16 claims
- 0261US10607920B2Semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 31, 2020·0 cites·8 claims
- 0361US10607921B2Method for forming a semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Granted Mar 31, 2020·0 cites·18 claims
- 0455US10177074B1Flexible semiconductor packageSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jan 8, 2019·0 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →