Inventor · disambiguated record
Hong Li
Also filed as: LI HONG · LI HONG-YU
100 granted patents·60 pending applications·194 citations·filing 2002–2025
99Inventor score
Files withHUAWEI TECH CO LTD82MICRON TECHNOLOGY INC14GUANGDONG OPPO MOBILE TELECOMMUNICATIONS CORP LTD4HONOR DEVICE CO LTD4LILLY CO ELI4
Top patents by PatentIndex Score
160 records- 0193US10939333B2Communication method and communications apparatus to implement a network slice based service in a central unit (CU)-distributed unit (DU) architectureHUAWEI TECH CO LTD·Filed 2019·Granted Mar 2, 2021·9 cites·28 claims
- 0291US10461185B2Assemblies having conductive structures along pillars of semiconductor materialMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 29, 2019·5 cites·5 claims
- 0391US8932598B2Fusion proteins and methods of useVAXINNATE CORP·Filed 2013·Granted Jan 13, 2015·16 cites·24 claims
- 0491US7368445B2Fused pyrazole derivatives as TGF-β signal transduction inhibitors for the treatment of fibrosis and neoplasmsLILLY CO ELI·Filed 2005·Granted May 6, 2008·19 cites·11 claims
- 0590US11265779B2Random access methods and apparatusHUAWEI TECH CO LTD·Filed 2019·Granted Mar 1, 2022·5 cites·16 claims
- 0689US11240700B2Communication method and access network deviceHUAWEI TECH CO LTD·Filed 2019·Granted Feb 1, 2022·5 cites·16 claims
- 0788US11310708B2Communication method, access network device, core network device, and user equipmentHONOR DEVICE CO LTD·Filed 2019·Granted Apr 19, 2022·3 cites·18 claims
- 0887US8652504B2Solid polymer delivery compositions and methods for use thereofLI HONG·Filed 2006·Granted Feb 18, 2014·14 cites·15 claims
- 0987US7511056B2TGF-β inhibitorsLILLY CO ELI·Filed 2005·Granted Mar 31, 2009·12 cites·4 claims
- 1086US2025022955A1Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated CircuitryMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1185US10887790B2Method for sending buffer status report and user equipmentHUAWEI TECH CO LTD·Filed 2019·Granted Jan 5, 2021·4 cites·25 claims
- 1285US10757624B2Communication method, access network device, and core network deviceHUAWEI TECH CO LTD·Filed 2019·Granted Aug 25, 2020·3 cites·6 claims
- 1385US10615165B1Methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2018·Granted Apr 7, 2020·3 cites·12 claims
- 1484US7087626B2Pyrrole derivatives as pharmaceutical agentsLILLY CO ELI·Filed 2002·Granted Aug 8, 2006·29 cites·7 claims
- 1583US12411796B2Management system, processing chip, apparatus, device, and methodHUAWEI TECH CO LTD·Filed 2023·Granted Sep 9, 2025·1 cites·20 claims
- 1683US8467392B2Method and system for data transmissionLI BOJIE·Filed 2012·Granted Jun 18, 2013·9 cites·21 claims
- 1783US2024365538A1Methods of Forming Integrated Assemblies Having Conductive Material Along Sidewall Surfaces of Semiconductor PillarsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1882US12200575B2Communication method, access network device, core network device, and user equipment for handling a handover requestHONOR DEVICE CO LTD·Filed 2023·Granted Jan 14, 2025·0 cites·20 claims
- 1982US11395256B2Communication method, device, and systemHUAWEI TECH CO LTD·Filed 2020·Granted Jul 19, 2022·1 cites·20 claims
- 2082US10531347B2Positioning method and apparatus for different time division duplex uplink-downlink configurationsHUAWEI TECH CO LTD·Filed 2017·Granted Jan 7, 2020·4 cites·12 claims
- 2181US11444088B2Methods of forming integrated assemblies having conductive material along sidewall surfaces of semiconductor pillarsMICRON TECHNOLOGY INC·Filed 2020·Granted Sep 13, 2022·1 cites·17 claims
- 2281US11290932B2Communication method, access network device, and core network deviceHUAWEI TECH CO LTD·Filed 2020·Granted Mar 29, 2022·1 cites·18 claims
- 2381US11159983B2Communication method and communications deviceHUAWEI TECH CO LTD·Filed 2019·Granted Oct 26, 2021·2 cites·14 claims
- 2481US10281560B2Positioning method based on time difference of arrival, user equipment, and network deviceHUAWEI TECH CO LTD·Filed 2018·Granted May 7, 2019·3 cites·16 claims
- 2580US12256246B2Communication method and apparatusHUAWEI TECH CO LTD·Filed 2021·Granted Mar 18, 2025·1 cites·18 claims
- 2680US10886282B2Integrated assemblies, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Jan 5, 2021·1 cites·21 claims
- 2780US10818673B2Methods of forming integrated assemblies having conductive material along sidewall surfaces of semiconductor pillarsMICRON TECHNOLOGY INC·Filed 2018·Granted Oct 27, 2020·2 cites·37 claims
- 2877US12063563B2Handover method, base station, and terminal deviceHUAWEI TECH CO LTD·Filed 2022·Granted Aug 13, 2024·0 cites·20 claims
- 2977US11792705B2Communication method and system in handover carrying NSSAI, and corresponding core network deviceHONOR DEVICE CO LTD·Filed 2022·Granted Oct 17, 2023·0 cites·20 claims
- 3077US9860808B2Method for handover judgment in coordinated multiple pointHUAWEI TECH CO LTD·Filed 2014·Granted Jan 2, 2018·4 cites·9 claims
- 3177US7405299B2Compounds as pharmaceutical agentsLILLY CO ELI·Filed 2003·Granted Jul 29, 2008·15 cites·1 claims
- 3276US12069852B2Methods of forming integrated assemblies having conductive material along sidewall surfaces of semiconductor pillarsMICRON TECHNOLOGY INC·Filed 2022·Granted Aug 20, 2024·0 cites·28 claims
- 3376US11877197B2Communication method and system by RRC carrying NSSAI, and corresponding core network deviceHONOR DEVICE CO LTD·Filed 2022·Granted Jan 16, 2024·0 cites·18 claims
- 3476US2025142875A1Assemblies Having Conductive Structures Along Pillars of Semiconductor Material, and Methods of Forming Integrated CircuitryMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3575US12142680B2Transistor structures having conductive structures along pillars of semiconductor materialMICRON TECHNOLOGY INC·Filed 2021·Granted Nov 12, 2024·0 cites·5 claims
- 3675US10299240B2Positioning parameter coordination apparatus, system, and methodHUAWEI TECH CO LTD·Filed 2017·Granted May 21, 2019·2 cites·19 claims
- 3775US2025151264A1Methods of Forming Integrated Assemblies Having Conductive Material Along Sidewall Surfaces of Semiconductor PillarsMICRON TECHNOLOGY INC·Filed 2025·Application pending·0 cites
- 3874US10390325B2Positioning method and deviceHUAWEI TECH CO LTD·Filed 2017·Granted Aug 20, 2019·2 cites·17 claims
- 3974US2023416769A1Compositions and methods for improving crop yields through trait stackingMONSANTO TECHNOLOGY LLC·Filed 2023·Application pending·0 cites
- 4073US2025374231A1Method for performing aggregated measurement on positioning reference signal prs and apparatusHUAWEI TECH CO LTD·Filed 2025·Application pending·0 cites
- 4171US10917831B2Radio access network slice generation method, radio access network, and slice managerHUAWEI TECH CO LTD·Filed 2018·Granted Feb 9, 2021·1 cites·18 claims
- 4270US11683720B2Communication method and communications deviceHUAWEI TECH CO LTD·Filed 2021·Granted Jun 20, 2023·0 cites·20 claims
- 4370US11508734B2Integrated assemblies, and methods of forming integrated assembliesMICRON TECHNOLOGY INC·Filed 2020·Granted Nov 22, 2022·0 cites·19 claims
- 4470US2025101186A1Hydrogels and methods of preparing the sameUNIV NANYANG TECH·Filed 2022·Application pending·0 cites
- 4569US11438818B2Handover method, base station, and terminal deviceHUAWEI TECH CO LTD·Filed 2020·Granted Sep 6, 2022·0 cites·20 claims
- 4669US8063035B2Triazolyl aminopyrimidine compoundsCRICH JOYCE Z·Filed 2008·Granted Nov 22, 2011·2 cites·8 claims
- 4768US11678239B2Communication method, base station, and terminalHUAWEI TECH CO LTD·Filed 2021·Granted Jun 13, 2023·0 cites·21 claims
- 4867US9521103B2Method, apparatus, and system for notifying and learning address information invalidationHUAWEI TECH CO LTD·Filed 2013·Granted Dec 13, 2016·2 cites·11 claims
- 4967US9517203B2Polymer particle delivery compositions and methods of useTURNELL WILLIAM G·Filed 2012·Granted Dec 13, 2016·2 cites·13 claims
- 5066US11024735B2Methods of forming integrated circuitryMICRON TECHNOLOGY INC·Filed 2019·Granted Jun 1, 2021·0 cites·21 claims
Showing the top 50 of 160 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →