Inventor · disambiguated record
How Kiat Liew
Also filed as: LIEW HOW KIAT
8 granted patents·5 pending applications·24 citations·filing 2014–2023
81Inventor score
Top patents by PatentIndex Score
13 records- 0192US10319639B2Thin semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Jun 11, 2019·15 cites·13 claims
- 0281US9281258B1Chip scale packages and related methodsSEMICONDUCTOR COMPONENTS IND·Filed 2014·Granted Mar 8, 2016·6 cites·20 claims
- 0375US9748163B1Die support for enlarging die sizeSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Aug 29, 2017·2 cites·19 claims
- 0471US11791297B2Molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2022·Granted Oct 17, 2023·0 cites·18 claims
- 0571US2024006363A1Molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2023·Application pending·0 cites
- 0665US11942369B2Thin semiconductor package for notched semiconductor dieSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Granted Mar 26, 2024·0 cites·15 claims
- 0761US10825754B2Quad flat no leads package with locking featureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2016·Granted Nov 3, 2020·1 cites·8 claims
- 0857US10763173B2Thin semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2019·Granted Sep 1, 2020·0 cites·20 claims
- 0954US2021043550A1Quad flat no leads package with locking featureSEMICONDUCTOR COMPONENTS IND LLC·Filed 2020·Application pending·0 cites
- 1053US11244918B2Molded semiconductor package and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Granted Feb 8, 2022·0 cites·16 claims
- 1151US2016111581A1Packaged semiconductor devices and related methodsSEMICONDUCTOR COMPONENTS IND·Filed 2014·Application pending·0 cites
- 1246US2017162742A1Packaged semiconductor devices and related methodsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2017·Application pending·0 cites
- 1334US2020035586A1Chip-on-lead semiconductor device packages with electrically isolated signal leadsSEMICONDUCTOR COMPONENTS IND LLC·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →