Inventor · disambiguated record

Hongshun Liu

Also filed as: LIU HONGSHUN

1 granted patent·1 citations·filing 2025–2025

14Inventor score

Technology areasF41B

Files withUNIV SHANDONG1

Top patents by PatentIndex Score

1 record

0190US12462078B1Modeling simulation and multi-field coupling analysis method and system for electromagnetic railgun systemUNIV SHANDONG·Filed 2025·Granted Nov 4, 2025·1 cites·5 claims

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →