Inventor · disambiguated record
Hongqiang Lu
Also filed as: LU HONGQIANG
9 granted patents·1 pending application·270 citations·filing 2001–2005
89Inventor score
Top patents by PatentIndex Score
10 records- 0193US6987059B1Method and structure for creating ultra low resistance damascene copper wiringLSI LOGIC CORP·Filed 2003·Granted Jan 17, 2006·70 cites·17 claims
- 0293US6969651B1Layout design and process to form nanotube cell for nanotube memory applicationsLSI LOGIC CORP·Filed 2004·Granted Nov 29, 2005·140 cites·17 claims
- 0383US7196420B1Method and structure for creating ultra low resistance damascene copper wiringLSI LOGIC CORP·Filed 2005·Granted Mar 27, 2007·10 cites·11 claims
- 0472US7675177B1Forming copper interconnects with Sn coatingsLSI CORP·Filed 2005·Granted Mar 9, 2010·3 cites·17 claims
- 0568US7033929B1Dual damascene interconnect structure with improved electro migration lifetimesLSI LOGIC CORP·Filed 2002·Granted Apr 25, 2006·13 cites·25 claims
- 0662US6686272B1Anti-reflective coatings for use at 248 nm and 193 nmLSI LOGIC CORP·Filed 2001·Granted Feb 3, 2004·20 cites·11 claims
- 0761US6884720B1Forming copper interconnects with Sn coatingsLSI LOGIC CORP·Filed 2003·Granted Apr 26, 2005·6 cites·14 claims
- 0859US6777807B1Interconnect integrationLSI LOGIC CORP·Filed 2003·Granted Aug 17, 2004·7 cites·15 claims
- 0958US7312532B2Dual damascene interconnect structure with improved electro migration lifetimesLSI CORP·Filed 2005·Granted Dec 25, 2007·1 cites·7 claims
- 1040US2004238960A1Interconnect integrationLSI LOGIC CORP·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →