Inventor · disambiguated record
Hongki Moon
Also filed as: MOON HONGKI
16 granted patents·7 pending applications·24 citations·filing 2017–2025
89Inventor score
Files withSAMSUNG ELECTRONICS CO LTD23
Top patents by PatentIndex Score
23 records- 0195US11181955B2Electronic device having thermal diffusion structureSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 23, 2021·5 cites·6 claims
- 0292US11735936B2Wireless charging deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Aug 22, 2023·2 cites·15 claims
- 0392US11714468B2Electronic device having thermal diffusion structureSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 1, 2023·2 cites·12 claims
- 0492US11388276B2Camera module including heat dissipating structure and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jul 12, 2022·5 cites·20 claims
- 0587US11871541B2Electronic device including vapor chamberSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 9, 2024·2 cites·20 claims
- 0684US11497141B2Heat dissipation device formed of nonmetallic material and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Nov 8, 2022·4 cites·19 claims
- 0776US12449866B2Electronic device having thermal diffusion structureSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Oct 21, 2025·0 cites·13 claims
- 0876US11503745B2Wireless charging deviceSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Nov 15, 2022·2 cites·20 claims
- 0970US11895767B2Electronic device filled with phase change material between plurality of circuit boards connected by connecting membersSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 6, 2024·1 cites·13 claims
- 1068US11910516B2Electronic device including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 20, 2024·1 cites·13 claims
- 1160US2025155944A1Electronic device including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1259US11881612B2Heat dissipation sheet and electronic device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Jan 23, 2024·0 cites·15 claims
- 1359US2025089211A1Frame structure and electronic device including sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1457US12501592B2Electronic device comprising thermal diffusion memberSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Dec 16, 2025·0 cites·15 claims
- 1556US2024385665A1Heat-radiating structure and electronic device comprising sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1656US2022167530A1Heat diffusion structure and electronic device with the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1755US12204384B2Electronic device including heat dissipation structureSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jan 21, 2025·0 cites·18 claims
- 1855US2025208669A1Electronic device comprising structure for dissipating heat generated in electronic deviceSAMSUNG ELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 1954US11051435B2Electronic device comprising heat-dissipating structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 29, 2021·0 cites·15 claims
- 2053US11202363B2Heat transfer member and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 14, 2021·0 cites·20 claims
- 2151US2023413484A1Electronic device comprising thermal management chamber using boilingSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 2249US2022330457A1Heat dissipation structure and electronic device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 2344US10775631B2Electronic device including moisture induction structureSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 15, 2020·0 cites·15 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →