Inventor · disambiguated record
Hodaka Rokubuichi
Also filed as: ROKUBUICHI HODAKA
11 granted patents·8 pending applications·7 citations·filing 2016–2023
81Inventor score
Technology areasH10W
Files withMITSUBISHI ELECTRIC CORP19
Top patents by PatentIndex Score
19 records- 0177US11424178B2Semiconductor moduleMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Aug 23, 2022·1 cites·8 claims
- 0276US10529643B2Semiconductor device and method of manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2016·Granted Jan 7, 2020·3 cites·13 claims
- 0372US11152280B2Semiconductor device and method for manufacturing the sameMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Oct 19, 2021·2 cites·13 claims
- 0463US11942400B2Semiconductor apparatus, manufacturing method for semiconductor apparatus, and power converterMITSUBISHI ELECTRIC CORP·Filed 2019·Granted Mar 26, 2024·1 cites·20 claims
- 0552US12477704B2Power semiconductor device and method of manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Granted Nov 18, 2025·0 cites·14 claims
- 0652US2025364368A1Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 0752US2025301760A1Power semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0851US2025246512A1Power module, method of manufacturing power module, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2023·Application pending·0 cites
- 0950US2025183233A1Power module semiconductor package and semiconductor apparatusMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1050US2025385163A1Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1147US2024222233A1Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1246US12512394B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Dec 30, 2025·0 cites·20 claims
- 1346US2024274489A1Power Semiconductor Device, Method for Manufacturing Same, and Power Conversion DeviceMITSUBISHI ELECTRIC CORP·Filed 2022·Application pending·0 cites
- 1444US11107756B2Semiconductor device and method for manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2017·Granted Aug 31, 2021·0 cites·20 claims
- 1543US12417951B2Semiconductor device and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2020·Granted Sep 16, 2025·0 cites·11 claims
- 1643US11784105B2Semiconductor device and power converterMITSUBISHI ELECTRIC CORP·Filed 2018·Granted Oct 10, 2023·0 cites·14 claims
- 1742US2024072026A1Semiconductor device, method of manufacturing same, and semiconductor packageMITSUBISHI ELECTRIC CORP·Filed 2021·Application pending·0 cites
- 1841US12308304B2Semiconductor device and method of manufacturing the same, and power conversion deviceMITSUBISHI ELECTRIC CORP·Filed 2019·Granted May 20, 2025·0 cites·15 claims
- 1939US11322430B2Semiconductor device and semiconductor module with a highest portion of a terminal lower than a highest portion of the mold sealing resinMITSUBISHI ELECTRIC CORP·Filed 2018·Granted May 3, 2022·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →