Inventor · disambiguated record
Holly Sawyer
Also filed as: SAWYER HOLLY · SAWYER HOLLY A
0 granted patents·5 pending applications·0 citations·filing 2018–2024
Technology areasH10W
Top patents by PatentIndex Score
5 records- 0173US2025118698A1Microelectronic assemblies including solder and non-solder interconnectsINTEL CORP·Filed 2024·Application pending·0 cites
- 0259US2023088170A1Microelectronic assemblies including solder and non-solder interconnectsINTEL CORP·Filed 2021·Application pending·0 cites
- 0358US2025293137A13d die stack redistribution layer for topside power delivery to backside die metallization in multichip composite devicesINTEL CORP·Filed 2024·Application pending·0 cites
- 0451US2024222283A1Methods and apparatus to prevent over-etch in semiconductor packagesINTEL CORP·Filed 2022·Application pending·0 cites
- 0539US2020098727A1Stacked wire-bond dice attached by pillars or bumps above a flip-chip die on a semiconductor package substrateMALLIK DEBENDRA·Filed 2018·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →