Inventor · disambiguated record
Hongxiao Shao
Also filed as: SHAO HONGXIAO
18 granted patents·2 pending applications·325 citations·filing 2011–2024
96Inventor score
Top patents by PatentIndex Score
20 records- 0199US9660584B2Power amplifier modules including wire bond pad and related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2015·Granted May 23, 2017·32 cites·20 claims
- 0298US11451199B2Power amplifier systems with control interface and bias circuitSKYWORKS SOLUTIONS INC·Filed 2020·Granted Sep 20, 2022·7 cites·20 claims
- 0398US10090812B2Power amplifier modules with bonding pads and related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2017·Granted Oct 2, 2018·22 cites·20 claims
- 0498US9847755B2Power amplifier modules with harmonic termination circuit and related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2016·Granted Dec 19, 2017·21 cites·22 claims
- 0598US9041472B2Power amplifier modules including related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2013·Granted May 26, 2015·70 cites·29 claims
- 0697US12143077B2Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer viaSKYWORKS SOLUTIONS INC·Filed 2022·Granted Nov 12, 2024·3 cites·20 claims
- 0797US9520835B2Power amplifier modules including bipolar transistor with grading and related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2015·Granted Dec 13, 2016·24 cites·20 claims
- 0896US10116274B2Process-compensated HBT power amplifier bias circuits and methodsSKYWORKS SOLUTIONS INC·Filed 2016·Granted Oct 30, 2018·20 cites·19 claims
- 0995US9419567B2Process-compensated HBT power amplifier bias circuits and methodsSKYWORKS SOLUTIONS INC·Filed 2013·Granted Aug 16, 2016·25 cites·18 claims
- 1095US8896091B2Apparatus and methods for reducing impact of high RF loss platingSKYWORKS SOLUTIONS INC·Filed 2014·Granted Nov 25, 2014·19 cites·20 claims
- 1194US9748627B2Devices and methods related to directional couplersSKYWORKS SOLUTIONS INC·Filed 2015·Granted Aug 29, 2017·18 cites·18 claims
- 1294US8889995B2Wire bond pad system and methodSUN WEIMIN·Filed 2011·Granted Nov 18, 2014·16 cites·20 claims
- 1394US8686537B2Apparatus and methods for reducing impact of high RF loss platingSUN WEIMIN·Filed 2011·Granted Apr 1, 2014·18 cites·27 claims
- 1492US10771024B2Power amplifier modules including transistor with grading and semiconductor resistorSKYWORKS SOLUTIONS INC·Filed 2018·Granted Sep 8, 2020·4 cites·22 claims
- 1591US10128558B2Directional couplers and devices including sameSKYWORKS SOLUTIONS INC·Filed 2017·Granted Nov 13, 2018·9 cites·16 claims
- 1691US2025030386A1Power amplifier systems including control interface and wire bond padSKYWORKS SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 1790US9287226B2Apparatus and methods for reducing impact of high RF loss platingSKYWORKS SOLUTIONS INC·Filed 2014·Granted Mar 15, 2016·8 cites·20 claims
- 1889US9472514B2Methods to fabricate a radio frequency integrated circuitSKYWORKS SOLUTIONS INC·Filed 2014·Granted Oct 18, 2016·7 cites·23 claims
- 1979US9859231B2Radio frequency integrated circuit moduleSKYWORKS SOLUTIONS INC·Filed 2016·Granted Jan 2, 2018·2 cites·20 claims
- 2051US2015124552A1System and method for mixing a gas and a liquidSHI YANG·Filed 2014·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →