Inventor · disambiguated record
Hong Shen
Also filed as: SHEN HONG · SHEN HONG-EN
114 granted patents·27 pending applications·1,633 citations·filing 1989–2025
99Inventor score
Top patents by PatentIndex Score
141 records- 0199US10446456B2Integrated circuits protected by substrates with cavities, and methods of manufactureINVENSAS CORP·Filed 2018·Granted Oct 15, 2019·172 cites·8 claims
- 0298US11056390B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2019·Granted Jul 6, 2021·38 cites·22 claims
- 0398US9824974B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2016·Granted Nov 21, 2017·54 cites·20 claims
- 0498US9741620B2Structures and methods for reliable packagesINVENSAS CORP·Filed 2015·Granted Aug 22, 2017·186 cites·20 claims
- 0598US9666559B2Multichip modules and methods of fabricationINVENSAS CORP·Filed 2015·Granted May 30, 2017·70 cites·19 claims
- 0698US9478504B1Microelectronic assemblies with cavities, and methods of fabricationINVENSAS CORP·Filed 2015·Granted Oct 25, 2016·64 cites·10 claims
- 0798US9397038B1Microelectronic components with features wrapping around protrusions of conductive vias protruding from through-holes passing through substratesINVENSAS CORP·Filed 2015·Granted Jul 19, 2016·27 cites·25 claims
- 0898US9252127B1Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufactureINVENSAS CORP·Filed 2014·Granted Feb 2, 2016·53 cites·14 claims
- 0998US9165793B1Making electrical components in handle wafers of integrated circuit packagesINVENSAS CORP·Filed 2014·Granted Oct 20, 2015·141 cites·20 claims
- 1098US9041472B2Power amplifier modules including related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2013·Granted May 26, 2015·70 cites·29 claims
- 1197US12143077B2Power amplifier modules including semiconductor resistor and tantalum nitride terminated through wafer viaSKYWORKS SOLUTIONS INC·Filed 2022·Granted Nov 12, 2024·3 cites·20 claims
- 1297US11114408B2System and method for providing 3D wafer assembly with known-good-diesINVENSAS CORP·Filed 2019·Granted Sep 7, 2021·20 cites·11 claims
- 1397US9324626B2Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabricationINVENSAS CORP·Filed 2014·Granted Apr 26, 2016·30 cites·30 claims
- 1496US9437536B1Reversed build-up substrate for 2.5DINVENSAS CORP·Filed 2015·Granted Sep 6, 2016·12 cites·24 claims
- 1595US9755592B2Power amplifier modules including tantalum nitride terminated through wafer via and related systems, devices, and methodsSKYWORKS SOLUTIONS INC·Filed 2016·Granted Sep 5, 2017·12 cites·20 claims
- 1695US9691696B2Interposers with circuit modules encapsulated by moldable material in a cavity, and methods of fabricationINVENSAS CORP·Filed 2016·Granted Jun 27, 2017·10 cites·20 claims
- 1794US10163833B2Multichip modules and methods of fabricationINVENSAS CORP·Filed 2017·Granted Dec 25, 2018·10 cites·14 claims
- 1894US8415805B2Etched wafers and methods of forming the sameSHEN HONG·Filed 2010·Granted Apr 9, 2013·20 cites·30 claims
- 1993US12040284B23D-interconnect with electromagnetic interference (“EMI”) shield and/or antennaINVENSAS LLC·Filed 2021·Granted Jul 16, 2024·2 cites·20 claims
- 2093US11205600B2Integrated circuits protected by substrates with cavities, and methods of manufactureINVENSAS CORP·Filed 2019·Granted Dec 21, 2021·9 cites·22 claims
- 2193US9548273B2Integrated circuit assemblies with rigid layers used for protection against mechanical thinning and for other purposes, and methods of fabricating such assembliesINVENSAS CORP·Filed 2015·Granted Jan 17, 2017·10 cites·20 claims
- 2293US7702153B2Systems and methods for segmenting object of interest from medical imageSIEMENS MEDICAL SOLUTIONS·Filed 2006·Granted Apr 20, 2010·57 cites·21 claims
- 2392US9412806B2Making multilayer 3D capacitors using arrays of upstanding rods or ridgesINVENSAS CORP·Filed 2014·Granted Aug 9, 2016·12 cites·15 claims
- 2492US7756316B2Method and system for automatic lung segmentationSIEMENS MEDICALS SOLUTIONS USA·Filed 2006·Granted Jul 13, 2010·73 cites·32 claims
- 2591US9899281B2Integrated circuits protected by substrates with cavities, and methods of manufactureINVENSAS CORP·Filed 2016·Granted Feb 20, 2018·4 cites·17 claims
- 2691US9402312B2Circuit assemblies with multiple interposer substrates, and methods of fabricationINVENSAS CORP·Filed 2014·Granted Jul 26, 2016·11 cites·16 claims
- 2788US10629468B2Device packaging using a recyclable carrier substrateSKYWORKS SOLUTIONS INC·Filed 2017·Granted Apr 21, 2020·6 cites·19 claims
- 2888US9093506B2Process for fabricating gallium arsenide devices with copper contact layerSHEN HONG·Filed 2012·Granted Jul 28, 2015·6 cites·17 claims
- 2987US10256177B2Integrated interposer solutions for 2D and 3D IC packagingINVENSAS CORP·Filed 2017·Granted Apr 9, 2019·4 cites·20 claims
- 3087US9508638B2Making electrical components in handle wafers of integrated circuit packagesINVENSAS CORP·Filed 2015·Granted Nov 29, 2016·4 cites·18 claims
- 3186US9888584B2Contact structures with porous networks for solder connections, and methods of fabricating sameINVENSAS CORP·Filed 2015·Granted Feb 6, 2018·4 cites·14 claims
- 3286US2025349741A1Region shielding within a package of a microelectronic deviceADEIA SEMICONDUCTOR TECH LLC·Filed 2025·Application pending·0 cites
- 3385US9865675B2Making multilayer 3D capacitors using arrays of upstanding rods or ridgesINVENSAS CORP·Filed 2016·Granted Jan 9, 2018·4 cites·13 claims
- 3485US9536862B2Microelectronic assemblies with integrated circuits and interposers with cavities, and methods of manufactureINVENSAS CORP·Filed 2015·Granted Jan 3, 2017·4 cites·13 claims
- 3584US10515926B2System and method for providing 3D wafer assembly with known-good-diesINVENSAS CORP·Filed 2017·Granted Dec 24, 2019·3 cites·14 claims
- 3684US9666560B1Multi-chip microelectronic assembly with built-up fine-patterned circuit structureINVENSAS CORP·Filed 2015·Granted May 30, 2017·4 cites·10 claims
- 3784US9502347B2Microelectronic assemblies formed using metal silicide, and methods of fabricationINVENSAS CORP·Filed 2015·Granted Nov 22, 2016·4 cites·21 claims
- 3884US7301535B23D summary display for reporting of organ tumorsSIEMENS MEDICAL SOLUTIONS·Filed 2005·Granted Nov 27, 2007·14 cites·19 claims
- 3983US9231068B2Methods of stress balancing in gallium arsenide wafer processingSKYWORKS SOLUTIONS INC·Filed 2014·Granted Jan 5, 2016·5 cites·17 claims
- 4083US7471815B2Candidate generation for lung nodule detectionSIEMENS MEDICAL SOLUTIONS·Filed 2005·Granted Dec 30, 2008·16 cites·15 claims
- 4182US7620226B2Semi-local active contour for a faint region detection in knee CT imagesSIEMENS MEDICAL SOLUTIONS·Filed 2005·Granted Nov 17, 2009·12 cites·13 claims
- 4282US6738063B2Object-correspondence identification without full volume registrationSIEMENS CORP RES INC·Filed 2002·Granted May 18, 2004·32 cites·16 claims
- 4381US12394728B2Method of forming a region shielding within a package of a microelectronic deviceADEIA SEMICONDUCTOR TECH LLC·Filed 2024·Granted Aug 19, 2025·0 cites·12 claims
- 4481US10204977B2Making electrical components in handle wafers of integrated circuit packagesINVENSAS CORP·Filed 2017·Granted Feb 12, 2019·2 cites·20 claims
- 4581US9946712B2Techniques for user identification of and translation of mediaGOOGLE INC·Filed 2013·Granted Apr 17, 2018·6 cites·20 claims
- 4681US9831302B2Making electrical components in handle wafers of integrated circuit packagesINVENSAS CORP·Filed 2016·Granted Nov 28, 2017·2 cites·20 claims
- 4781US9812406B2Microelectronic assemblies with cavities, and methods of fabricationINVENSAS CORP·Filed 2016·Granted Nov 7, 2017·3 cites·20 claims
- 4881US7627159B22D visualization for rib analysisSIEMENS MEDICAL SOLUTIONS·Filed 2005·Granted Dec 1, 2009·11 cites·18 claims
- 4980US11247154B2Truncated filter capsuleSAINT GOBAIN PERFORMANCE PLASTICS CORP·Filed 2019·Granted Feb 15, 2022·1 cites·18 claims
- 5080US9754866B2Reversed build-up substrate for 2.5DINVENSAS CORP·Filed 2016·Granted Sep 5, 2017·2 cites·20 claims
Showing the top 50 of 141 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →