Inventor · disambiguated record
Hong Shi
Also filed as: SHI HONG · Shi hong-bin
10 granted patents·3 pending applications·23 citations·filing 2010–2022
83Inventor score
Technology areasH10W
Top patents by PatentIndex Score
13 records- 0195US11950358B1Integrated circuit package with voltage droop mitigationXILINX INC·Filed 2021·Granted Apr 2, 2024·3 cites·20 claims
- 0293US12136613B2Chip package with near-die integrated passive deviceXILINX INC·Filed 2022·Granted Nov 5, 2024·2 cites·20 claims
- 0391US11688675B1Core cavity noise isolation structure for use in chip packagesXILINX INC·Filed 2021·Granted Jun 27, 2023·2 cites·17 claims
- 0491US11043484B1Method and apparatus of package enabled ESD protectionXILINX INC·Filed 2019·Granted Jun 22, 2021·8 cites·20 claims
- 0584US10057976B1Power-ground co-reference transceiver structure to deliver ultra-low crosstalkXILINX INC·Filed 2017·Granted Aug 21, 2018·7 cites·20 claims
- 0680US11302674B2Modular stacked silicon package assemblyXILINX INC·Filed 2020·Granted Apr 12, 2022·1 cites·20 claims
- 0759US11735519B2In-package passive inductive element for reflection mitigationXILINX INC·Filed 2021·Granted Aug 22, 2023·0 cites·20 claims
- 0854US12354978B2Coupled loop and void structure integrated in a redistribution layer of a chip packageXILINX INC·Filed 2022·Granted Jul 8, 2025·0 cites·20 claims
- 0944US10770364B2Chip scale package (CSP) including shim dieXILINX INC·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 1043US2015282299A1Thin profile metal trace to suppress skin effect and extend package interconnect bandwidthXILINX INC·Filed 2014·Application pending·0 cites
- 1140US10314163B2Low crosstalk vertical connection interfaceXILINX INC·Filed 2017·Granted Jun 4, 2019·0 cites·20 claims
- 1232US2011235297A1Integrated circuit package component with lateral conductive pinsQUANTA COMP INC·Filed 2010·Application pending·0 cites
- 1332US2011235296A1Integrated circuit package component with ball conducting jointsQUANTA COMP INC·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →