Inventor · disambiguated record
Hong-Seng Shue
Also filed as: SHUE HONG-SENG
26 granted patents·8 pending applications·45 citations·filing 2012–2025
93Inventor score
Files withTAIWAN SEMICONDUCTOR MFG CO LTD29TAIWAN SEMICONDUCTOR MFG2SHUE HONG-SENG1YANG TAI-I1YU SHAO-CHI1
Top patents by PatentIndex Score
34 records- 0197US11908790B2Chip structure with conductive via structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·5 cites·20 claims
- 0295US11348884B1Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 31, 2022·4 cites·20 claims
- 0390US11088037B2Semiconductor device having probe pads and seal ringTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 10, 2021·6 cites·20 claims
- 0489US11075173B2Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 27, 2021·5 cites·20 claims
- 0588US10861810B2Shielding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 8, 2020·5 cites·20 claims
- 0684US9269609B2Semiconductor isolation structure with air gaps in deep trenchesSHUE HONG-SENG·Filed 2012·Granted Feb 23, 2016·10 cites·20 claims
- 0784US2025336866A1Bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0881US10049941B2Semiconductor isolation structure with air gaps in deep trenchesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Aug 14, 2018·3 cites·20 claims
- 0981US2024379589A1Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1078US12142582B2Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Nov 12, 2024·0 cites·20 claims
- 1178US2024363569A1Bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1277US2024379584A1Semiconductor device and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1376US8558330B2Deep well process for MEMS pressure sensorYU SHAO-CHI·Filed 2012·Granted Oct 15, 2013·5 cites·20 claims
- 1475US11769741B2Organic interposer including a dual-layer inductor structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 26, 2023·0 cites·20 claims
- 1574US2024332220A1Interposer including a copper edge seal ring structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 1670US12087648B2Seal ring structure with zigzag patterns and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 10, 2024·0 cites·20 claims
- 1770US12057423B2Bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 6, 2024·0 cites·20 claims
- 1869US2024120277A1Chip structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Application pending·0 cites
- 1968US8953155B1Optical inspection system and optical inspection methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 10, 2015·1 cites·19 claims
- 2066US11854913B2Method for detecting defects in semiconductor deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·0 cites·20 claims
- 2165US11380639B2Shielding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·0 cites·20 claims
- 2265US2022367347A1Chip structure with conductive via structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Application pending·0 cites
- 2362US12040289B2Interposer including a copper edge seal ring structure and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jul 16, 2024·0 cites·20 claims
- 2461US11855022B2Shielding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Dec 26, 2023·0 cites·20 claims
- 2555US9496221B2Method for forming fuse pad and bond pad of integrated circuitYANG TAI-I·Filed 2012·Granted Nov 15, 2016·1 cites·20 claims
- 2655US9096428B2Methods and apparatus for MEMS structure releaseTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·0 cites·20 claims
- 2752US11848270B2Chip structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 19, 2023·0 cites·20 claims
- 2851US11342291B2Semiconductor packages with crack preventing structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 24, 2022·0 cites·20 claims
- 2951US9093520B2High-voltage super junction by trench and epitaxial dopingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 28, 2015·0 cites·12 claims
- 3050US11011462B2Method for forming fuse pad and bond pad of integrated circuitTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 18, 2021·0 cites·11 claims
- 3148US9558986B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 31, 2017·0 cites·14 claims
- 3247US2015308743A1Methods And Apparatus For MEMS Structure ReleaseTAIWAN SEMICONDUCTOR MFG·Filed 2015·Application pending·0 cites
- 3346US9614031B2Methods for forming a high-voltage super junction by trench and epitaxial dopingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 4, 2017·0 cites·20 claims
- 3441US8975153B2Super junction trench metal oxide semiconductor device and method of making the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Mar 10, 2015·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →