Inventor · disambiguated record
Hoay Tien Teoh
Also filed as: TEOH HOAY TIEN
13 granted patents·1 pending application·59 citations·filing 2012–2022
86Inventor score
Top patents by PatentIndex Score
14 records- 0196US9972589B1Integrated circuit package substrate with microstrip architecture and electrically grounded surface conductive layerINTEL CORP·Filed 2017·Granted May 15, 2018·47 cites·22 claims
- 0280US9257368B2Microelectric package utilizing multiple bumpless build-up structures and through-silicon viasGOH ENG HUAT·Filed 2012·Granted Feb 9, 2016·7 cites·30 claims
- 0375US10411001B2Dynamic random access memory (DRAM) mountsINTEL CORP·Filed 2015·Granted Sep 10, 2019·2 cites·15 claims
- 0475US9613920B2Microelectronic package utilizing multiple bumpless build-up structures and through-silicon viasINTEL CORP·Filed 2015·Granted Apr 4, 2017·2 cites·20 claims
- 0569US11264315B2Electronic package with passive component between substratesINTEL CORP·Filed 2017·Granted Mar 1, 2022·1 cites·11 claims
- 0665US12500155B2Electronic package with passive component between substratesINTEL CORP·Filed 2022·Granted Dec 16, 2025·0 cites·16 claims
- 0759US10861839B2Dynamic random access memory (DRAM) mountsINTEL CORP·Filed 2019·Granted Dec 8, 2020·0 cites·12 claims
- 0847US11696409B2Vertical embedded component in a printed circuit board blind holeINTEL CORP·Filed 2016·Granted Jul 4, 2023·0 cites·14 claims
- 0946US10163777B2Interconnects for semiconductor packagesINTEL CORP·Filed 2017·Granted Dec 25, 2018·0 cites·14 claims
- 1045US9960224B2Three capacitor stack and associated methodsINTEL CORP·Filed 2016·Granted May 1, 2018·0 cites·25 claims
- 1144US10785872B2Package jumper interconnectINTEL CORP·Filed 2019·Granted Sep 22, 2020·0 cites·10 claims
- 1243US9907170B2FPC connector for better signal integrity and design compactionINTEL CORP·Filed 2015·Granted Feb 27, 2018·0 cites·16 claims
- 1339US10492299B2Electronic assembly that includes a substrate bridgeINTEL CORP·Filed 2015·Granted Nov 26, 2019·0 cites·8 claims
- 1435US2013313727A1Multi-stacked bbul packageGOH ENG HUAT·Filed 2012·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Hoay Tien Teoh files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →